5SGXEA7K1F40I2G

The 5SGXEA7K1F40I2G is an Intel Stratix V GX FPGA supplied in a 1517-BBGA FCBGA package. It provides a high-density programmable fabric with 622,000 logic elements and approximately 51.2 Mbits of embedded RAM, alongside 696 user I/O pins for complex, I/O-heavy designs.

Designed as an industrial-grade device, this FPGA operates over a core-voltage range of 870 mV to 930 mV and an ambient temperature range of –40 °C to 100 °C, making it appropriate for systems that require extended temperature tolerance and robust on-board resources.

Key Features

• High Logic Capacity  622,000 logic elements for dense programmable logic implementations.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffering, state storage, and memory-intensive algorithms without external memory dependency.
• Extensive I/O  696 user I/O pins to enable connectivity to multiple peripherals, high-pin-count interfaces, and complex board-level routing.
• Industrial Temperature Grade  Qualified for –40 °C to 100 °C operation, suitable for equipment operating in wide temperature environments.
• Low-Voltage Core  Specifies a core supply window of 870 mV to 930 mV for optimized power-domain design and system power budgeting.
• Package and Mounting  1517-BBGA (1517-FBGA 40×40) FCBGA surface-mount package for high I/O density and reliable board integration.
• RoHS Compliant  Meets RoHS requirements for reduced hazardous substances.

Typical Applications

• High-density logic integration  Use the 622,000 logic elements and large embedded RAM to consolidate complex logic blocks and algorithms onto a single device.
• Data buffering and packet processing  Approximately 51.2 Mbits of on-chip memory supports buffering, queuing, and packet manipulation without immediate external memory dependence.
• Multi-interface systems  696 I/Os accommodate numerous parallel interfaces, high-pin-count peripherals, and multi-channel front-end connectivity.

Unique Advantages

• High on-chip integration: Combining 622,000 logic elements with ~51.2 Mbits of RAM reduces the need for external components and simplifies system BOM.
• Robust I/O capacity: 696 I/Os enable flexible board designs and support a wide range of peripheral and interface connections.
• Industrial-grade thermal range: –40 °C to 100 °C operation supports deployments in environments with extended temperature demands.
• Compact, high-density package: 1517-BBGA FCBGA package allows high signal density in space-constrained PCBs while supporting reliable surface-mount assembly.
• Power-domain predictability: Defined core supply range (870 mV–930 mV) helps streamline power-supply design and system-level power planning.
• Regulatory readiness: RoHS compliance facilitates integration into designs targeting regions with hazardous-substance restrictions.

Why Choose 5SGXEA7K1F40I2G?

The 5SGXEA7K1F40I2G combines substantial logic density, significant on-chip memory, and a high I/O count in a single industrial-grade Stratix V GX FPGA package. Its defined voltage and temperature ranges provide predictable electrical and thermal integration for demanding designs.

This device is well suited to engineers and system designers who need a single, high-capacity programmable device to consolidate complex logic, large buffers, and multiple interfaces while maintaining industrial temperature tolerance and RoHS compliance.

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