5SGXEA7K2F35C1N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 51200000 622000 1152-BBGA, FCBGA

Quantity 89 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7K2F35C1N – Stratix® V GX FPGA, 622,000 logic elements, ~51.2 Mbits RAM, 432 I/Os, 1152-BBGA

The 5SGXEA7K2F35C1N is a Stratix® V GX Field Programmable Gate Array (FPGA) offered in a 1152-BBGA surface-mount package. The device delivers 622,000 logic elements and approximately 51.2 Mbits of embedded memory, providing substantial on-chip resources for complex programmable logic designs.

As a commercial-grade Stratix V GX device, it operates with a core supply range of 0.870 V to 0.930 V and an ambient temperature range of 0 °C to 85 °C. Series-level documentation for Stratix V GX devices includes electrical and switching characteristics and transceiver-related details useful for system-level planning.

Key Features

  • Logic Capacity  622,000 logic elements for integrating extensive programmable logic on a single device.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic.
  • I/O and Packaging  432 I/Os with a 1152-BBGA package (supplier device package: 1152-FBGA, 35×35) optimized for surface-mount assembly.
  • Power  Core supply voltage range of 870 mV to 930 mV to match low-voltage FPGA power domains.
  • Temperature and Grade  Commercial temperature grade rated for operation from 0 °C to 85 °C.
  • Compliance  RoHS compliant for environmental compliance in commercial applications.

Typical Applications

  • I/O‑dense system integration  Designs that require a high number of direct I/Os can leverage the device’s 432 I/O pins to minimize external multiplexing.
  • Large on-chip logic implementations  Systems needing substantial programmable logic capacity can consolidate functions using the 622,000 logic elements.
  • Memory‑heavy designs  Applications that benefit from significant on-chip RAM for buffering or state machines can use the approximately 51.2 Mbits of embedded memory.
  • Commercial electronic products  Products and prototypes intended for commercial temperature environments (0 °C to 85 °C) and standard RoHS compliance.

Unique Advantages

  • High logic density: 622,000 logic elements enable consolidation of complex functions on a single FPGA, reducing the need for multiple devices.
  • Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory components and simplifies board design.
  • Generous I/O count: 432 I/Os provide flexible interfacing for parallel buses, peripherals, and multiple interfaces without extensive external logic.
  • Compact BGA package: 1152-BBGA (supplier 1152-FBGA, 35×35) surface-mount format supports dense PCB layouts and industry-standard assembly workflows.
  • Low-voltage core operation: 0.870–0.930 V supply range aligns with contemporary low-voltage FPGA core domains and power-management strategies.
  • Commercial readiness and compliance: Rated for 0 °C to 85 °C and RoHS compliant for deployment in commercial electronic products.

Why Choose 5SGXEA7K2F35C1N?

The 5SGXEA7K2F35C1N positions itself as a high-capacity, commercially graded Stratix V GX FPGA that combines large logic resources, significant embedded memory, and a high I/O count in a compact 1152-BBGA surface-mount package. Its electrical characteristics and series-level documentation support system designers in planning power, I/O timing, and device-level integration.

This device is well-suited for design teams and integrators who require dense programmable logic and on-chip memory within a commercial temperature envelope and standard RoHS compliance. The part offers a clear path for consolidating complex functions onto a single FPGA while retaining flexibility for board-level implementation.

Request a quote or submit a pricing and availability inquiry to begin evaluating 5SGXEA7K2F35C1N for your next design project.

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