5SGXEA7K1F40I2N

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA

Quantity 16 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7K1F40I2N – Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA

The 5SGXEA7K1F40I2N is a Stratix V GX family FPGA IC from Intel (Altera) designed for high-density, high-performance digital logic integration. It provides a large programmable fabric with 622,000 logic elements and approximately 51.2 Mbits of embedded memory, suitable for complex control, signal processing, and system integration tasks.

Packaged in a 1517-ball FCBGA (1517-FBGA, 40×40) surface-mount package, this industrial-grade device supports wide I/O capacity and an extended operating range, making it appropriate for demanding embedded and industrial applications.

Key Features

  • Core Density  622,000 logic elements to implement complex logic, custom datapaths, and state machines.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and large data structures without external memory dependence.
  • I/O Capacity  696 I/Os to support broad peripheral connectivity and multi-channel interfacing.
  • Package  1517-BBGA (FCBGA) surface-mount package, supplier device package listed as 1517-FBGA (40×40) for compact board-level integration.
  • Power Supply  Core voltage supply specified at 870 mV to 930 mV for the device core domain.
  • Industrial Grade Temperature  Rated for operation from −40 °C to 100 °C to meet extended-environment requirements.
  • Mounting  Surface-mount assembly compatible with standard PCB manufacturing processes.
  • Compliance  RoHS compliant.

Typical Applications

  • High-density digital processing  Implement large custom accelerators, signal processing pipelines, or complex logic control using the device's extensive logic element count and embedded RAM.
  • Multi-channel I/O systems  Use the 696 I/Os to interface multiple sensors, transceivers, or peripheral buses in communications and instrumentation systems.
  • Industrial control and automation  Leverage the industrial temperature rating and robust package for factory automation, motor control, and real-time control logic.
  • Integrated system prototypes  Deploy the device as a central programmable hub for complex proofs-of-concept and platform development requiring high logic capacity and on-chip memory.

Unique Advantages

  • High logic density: 622,000 logic elements enable consolidation of multiple functions on a single device, reducing board-level BOM and interconnect complexity.
  • Large on-chip memory: Approximately 51.2 Mbits of embedded RAM support extensive buffering and state storage without immediate reliance on external memory.
  • Extensive I/O resources: 696 I/Os permit broad peripheral and bus connectivity for multi-channel and high-pin-count designs.
  • Industrial temperature capability: −40 °C to 100 °C operation supports deployment in extended-environment industrial applications.
  • Compact FCBGA packaging: 1517-ball FCBGA (40×40) provides a high-pin-count solution in a compact footprint for dense system integration.
  • Regulatory readiness: RoHS compliance aligns the device with common environmental requirements.

Why Choose 5SGXEA7K1F40I2N?

The 5SGXEA7K1F40I2N delivers a combination of high logic capacity, substantial on-chip memory, and a large I/O complement in a compact FCBGA package targeted at industrial applications. As a member of the Stratix V GX family, it is positioned for designs that require dense programmable logic and significant embedded memory while operating across an extended temperature range.

This device is well suited to engineering teams building complex, scalable systems that benefit from integrating multiple functions into a single FPGA fabric—reducing component count and simplifying board-level design while maintaining the capacity needed for advanced processing and interfacing tasks.

If you would like pricing, availability, or to request a quote for 5SGXEA7K1F40I2N, submit an inquiry or request a quote through your preferred procurement channel.

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