5SGXEA7K1F40C2WN

The 5SGXEA7K1F40C2WN is a Stratix V GX field-programmable gate array (FPGA) IC intended for high-density, high-performance designs. It combines a large logic fabric, significant embedded memory, and extensive I/O to address complex digital processing and system-integration requirements.

Key architectural attributes include 622,000 logic elements, approximately 51.2 Mbits of embedded RAM, and up to 696 I/Os. The device is supplied in a 1517-ball BGA (FCBGA) package and is offered in a commercial temperature grade, providing a clear specification set for system design and procurement.

Key Features

• Core Logic  622,000 logic elements (cells) for dense logic implementation and large-scale digital designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, packet memory, and algorithm state storage.
• I/O Capacity  Up to 696 user I/Os to support wide parallel interfaces and diverse board-level connectivity.
• Power and Voltage  Core supply range specified at 870 mV to 930 mV for defined power and timing design margins.
• Package & Mounting  1517-ball BGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount device for standard PCB assembly flows.
• Temperature Grade  Commercial grade operation with an ambient operating range of 0°C to 85°C.
• Series Transceiver Capability (Series-Level)  As a Stratix V GX family device, the series includes transceiver speed-grade options that can reach up to 14.1 Gbps per channel (varies by speed grade).
• Regulatory  RoHS compliant.

Unique Advantages

• High logic density: 622,000 logic elements enable complex FPGA implementations without external discrete logic.
• Large on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and processing tasks.
• Extensive I/O count: Up to 696 I/Os supports diverse interface needs and large parallel buses on a single device.
• Defined power envelope: Core supply specified between 870 mV and 930 mV allows predictable power budgeting and timing closure.
• Compact BGA package: 1517-ball FCBGA (40×40) package balances high pin-count with a compact board footprint for dense system designs.
• Commercial temperature rating: Rated 0°C to 85°C for standard commercial deployments and controlled-environment applications.

Why Choose 5SGXEA7K1F40C2WN?

The 5SGXEA7K1F40C2WN delivers a combination of high logic capacity, substantial embedded RAM, and large I/O resources in a compact 1517-BBGA package, making it suitable for complex digital designs that require on-chip memory and broad connectivity. Its defined electrical and thermal specifications—commercial temperature grade and a specified core supply range—help engineering and procurement teams design with clarity and predictability.

This device is appropriate for projects that demand high integration density and series-level high-speed transceiver options. The Stratix V GX family pedigree provides documented series characteristics that can guide system-level planning and scaling.

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