5SGXEA7N1F45C1WN

The 5SGXEA7N1F45C1WN is a Stratix® V GX field-programmable gate array (FPGA) from Intel, offered in a 1932‑ball FCBGA package. It delivers very large logic density and embedded memory for complex, high‑gate-count designs.

As a Stratix V GX family device, it is positioned for designs requiring high logic element counts, substantial on‑chip RAM, and extensive I/O capacity, while supporting the family’s high‑speed transceiver capabilities described in the device documentation.

Key Features

• Logic Capacity  622,000 logic elements suitable for large, multi‑block digital designs.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM for buffering, lookup tables, and local storage.
• I/O Resources  Up to 840 I/O pins to support wide parallel interfaces and rich peripheral connectivity.
• Transceiver Family Capabilities  Part of the Stratix V GX family, which the device documentation lists with GX channel speed grades up to family‑level values (see Intel Stratix V documentation for details).
• Power and Core Voltage  Core supply range specified at 870 mV to 930 mV for device operation.
• Package and Mounting  1932‑ball BGA (FCBGA) package; supplier package noted as 1932‑FBGA, FC (45×45). Surface‑mount device.
• Commercial Grade Temperature  Rated operating temperature 0 °C to 85 °C (commercial grade).
• Regulatory Compliance  RoHS‑compliant.

Typical Applications

• High‑density digital signal processing  Use the large logic fabric and ~51.2 Mbits of embedded RAM to implement multi‑channel DSP pipelines and real‑time processing blocks.
• High‑speed serial and communication systems  Leverage the Stratix V GX family transceiver capabilities and 840 I/O for networking, backplane, and protocol bridging applications.
• Complex control and compute  Deploy the device where many parallel interfaces and substantial logic resources are required for system control, aggregation, or protocol handling.

Unique Advantages

• Very high logic density: 622,000 logic elements enable integration of large FPGA designs that would otherwise require multiple devices.
• Significant on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces external memory dependency and simplifies board design.
• Extensive I/O count: 840 I/Os provide flexibility for wide buses, multi‑lane interfaces, and numerous peripherals.
• FCBGA footprint for compact systems: 1932‑ball package offers high pin count in a compact BGA form factor for space‑constrained boards.
• Commercial temperature and RoHS compliance: Designed for standard commercial deployments with RoHS‑compliant materials.

Why Choose 5SGXEA7N1F45C1WN?

This Stratix V GX device combines substantial logic and memory resources with a high I/O count in a compact FCBGA package, making it well suited for designers tackling high‑complexity digital, signal processing, and high‑bandwidth interfacing tasks. Its specifications are consistent with the Stratix V GX family documentation, offering a path to deploy large, integrated FPGA solutions within commercial temperature environments.

Backed by Intel’s Stratix V device documentation, the 5SGXEA7N1F45C1WN is intended for teams that need scalable logic capacity, on‑chip memory density, and plentiful I/O in a single programmable device.

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