5SGXEA7N1F45C2LN

The 5SGXEA7N1F45C2LN is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel, supplied in a 1932-ball FCBGA package for surface-mount applications. This device delivers large programmable logic capacity and substantial on-chip memory in a single, high-pin-count package.

Targeted for high-density, reconfigurable digital designs, the device provides a combination of 622,000 logic element cells, approximately 51.2 Mbits of embedded memory, and 840 programmable I/Os to support complex system integration while operating from a low-voltage core supply.

Key Features

• Core Logic  622,000 logic element cells provide extensive programmable logic resources for complex designs; specification also lists 234,720 LABs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffers, lookup tables, and state storage without external memory.
• I/O Density  840 total I/Os enable high-pin-count connectivity for multi-channel interfaces and dense board-level integration.
• Power  Core supply specified between 820 mV and 880 mV for low-voltage operation.
• Package & Mounting  1932-BBGA (1932-FBGA, FC 45×45) FCBGA surface-mount package suited for compact, high-density PCBs.
• Temperature Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital systems  Use where large programmable logic capacity (622,000 logic element cells) is required for integration of complex digital functions.
• Memory-intensive designs  Ideal for systems that require substantial on-chip buffering or lookup storage thanks to approximately 51.2 Mbits of embedded RAM.
• High-pin-count interfacing  Suitable for designs needing extensive external connectivity, with up to 840 I/Os available for multi-channel or parallel interfaces.
• Low-voltage core architectures  Applications that operate with a low-voltage core supply (820 mV–880 mV) and require a commercial temperature grade device.

Unique Advantages

• Highly integrated logic and memory: Combines 622,000 logic element cells with approximately 51.2 Mbits of embedded RAM to reduce reliance on external components.
• Very high I/O count: 840 I/Os support dense board-level routing and multiple peripheral channels without additional I/O expanders.
• Compact, production-ready package: 1932-BBGA FCBGA package provides a compact footprint for high-density PCB layouts and surface-mount assembly.
• Low-voltage operation: Core supply range of 820 mV to 880 mV helps designs targeting low-power core domains.
• Commercial temperature support: Rated for 0 °C to 85 °C operation to match commercial-grade system requirements.
• RoHS compliant: Meets environmental regulatory requirements for lead-free manufacturing.

Why Choose 5SGXEA7N1F45C2LN?

The 5SGXEA7N1F45C2LN positions itself as a high-capacity Stratix V GX FPGA option for designers needing a balance of logic density, embedded memory, and extensive I/O in a single, surface-mount package. Its combination of 622,000 logic element cells, approximately 51.2 Mbits of on-chip RAM, and 840 I/Os makes it suitable for complex, reconfigurable digital systems where board-level integration and consolidation are priorities.

Backed by Intel's Stratix V family documentation and offered in a commercial temperature grade with RoHS compliance, this device is appropriate for development and production environments that require substantial programmable resources, compact packaging, and low-voltage core operation.

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