5SGXEA7N1F45C2LG

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 51200000 622000 1932-BBGA, FCBGA

Quantity 1,387 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7N1F45C2LG – Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 51200000 622000 1932-BBGA, FCBGA

The 5SGXEA7N1F45C2LG is a Stratix V GX-series FPGA offering large logic capacity, abundant embedded memory, and a high I/O count in a 1932-ball FCBGA package. As a commercial-grade Stratix V GX device, it targets designs that require significant programmable logic resources, extensive on-chip RAM, and broad external connectivity.

Key attributes include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, 840 I/O pins, and a rated operating voltage range of 820 mV to 880 mV. The device is RoHS compliant and specified for a 0 °C to 85 °C operating range.

Key Features

  • Core Logic  622,000 logic elements provide substantial capacity for complex digital designs and large-scale integration.
  • Logic Array Blocks (LABs)  234,720 LABs give a granular resource structure for mapping large designs (value taken from device resource specification).
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, FIFOs, and local storage for high-throughput data paths.
  • I/O Density  840 general-purpose I/O pins enable broad external connectivity and interface flexibility for multi-channel systems.
  • Package & Mounting  1932-BBGA (FCBGA) supplier package (1932-FBGA, FC 45×45) in a surface-mount form factor for compact board-level integration.
  • Power Domain  Core supply range of 820 mV to 880 mV to match system power-rail designs and voltage budgeting.
  • Commercial Temperature Grade  Specified operating temperature range of 0 °C to 85 °C for commercial applications.
  • Regulatory  RoHS compliant, supporting environmentally regulated product requirements.

Typical Applications

  • High-speed serial communications  Stratix V GX-series transceiver capability at the series level supports designs that implement high-bandwidth serial links and packet processing.
  • Complex signal processing  Large logic density and substantial embedded RAM enable DSP, filtering, and compute-accelerator implementations.
  • Multi-interface systems  High I/O count supports integration of multiple parallel and serial interfaces for routers, switches, and data aggregation modules.

Unique Advantages

  • High integration density: 622,000 logic elements and 234,720 LABs deliver the resources needed to consolidate multiple functions into a single device.
  • Large on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces reliance on external memory for buffering and accelerates data-path throughput.
  • Extensive I/O: 840 I/O pins provide flexibility for interfacing with many peripherals and board-level components without external multiplexing.
  • Compact FCBGA package: The 1932-ball FCBGA (45×45) balances high-pin-count integration with a board-friendly surface-mount footprint.
  • Commercial availability: Commercial temperature grade and RoHS compliance ease deployment in standard commercial products and manufacturing flows.
  • Controlled core voltage: A defined core supply window (820 mV–880 mV) helps simplify power-supply design and margining.

Why Choose 5SGXEA7N1F45C2LG?

The 5SGXEA7N1F45C2LG positions itself as a high-capacity Stratix V GX FPGA suitable for projects that require large programmable logic resources, substantial embedded memory, and a wide array of I/O. Its FCBGA package and surface-mount mounting make it suitable for compact, high-density board layouts while its commercial temperature rating fits general-purpose electronic products.

Design teams seeking a scalable, resource-rich FPGA with clear electrical and packaging specifications will find this device well-suited for complex communications, signal-processing, and multi-interface applications. The combination of logic density, embedded RAM, and I/O count supports consolidation of functions to reduce system-level BOM and board complexity.

If you would like availability, pricing, or a technical quote for 5SGXEA7N1F45C2LG, request a quote or submit an inquiry to receive detailed commercial information and ordering assistance.

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