5SGXEA7N1F45C2G

The 5SGXEA7N1F45C2G is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, offered in a 1932-ball FCBGA package. It provides a large programmable fabric with high I/O density and significant on-chip RAM to support complex, high-capacity designs.

Targeted at designs requiring extensive logic resources and dense I/O, this commercial-grade device combines approximately 622,000 logic elements, about 51.2 Mbits of embedded memory, and 840 user I/O pins in a surface-mount BGA package, with operating supply and temperature ranges suitable for commercial systems.

Key Features

• Core Capacity  Approximately 622,000 logic elements, providing a large programmable fabric for high-density logic integration.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, large FIFOs, and implemented data structures without external memory.
• I/O Density  840 user I/O pins to support wide buses, parallel interfaces, and multiple high-pin-count peripherals.
• Transceiver Capability (Series-Level)  Stratix V GX devices in the series support transceiver speed grades listed in the series datasheet (examples include up to 14.1 Gbps per channel for the GX channel speed grade entries).
• Power and Supply  Device core supply range specified at 870 mV to 930 mV for design planning and power budgeting.
• Package and Mounting  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount device for standard PCB assembly.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital processing  Large programmable fabric and abundant on-chip RAM enable complex data-path implementations and custom compute kernels.
• Multi-channel I/O aggregation  High I/O count supports aggregation of parallel interfaces, wide buses, and multi-channel front-ends.
• Prototyping and system integration  Surface-mount BGA package and comprehensive device capacity make it suitable for prototype platforms and integration into advanced electronic systems.
• Embedded memory–intensive designs  Approximately 51.2 Mbits of embedded RAM allow on-chip storage for buffering, packet queues, and state machines.

Unique Advantages

• Large logic capacity: Approximately 622,000 logic elements enable consolidation of complex functions onto a single device, reducing BOM and board-level interconnect.
• Significant on-chip memory: About 51.2 Mbits of embedded RAM reduces reliance on external memory for many buffering and temporary storage needs.
• High I/O count: 840 user I/O pins provide flexibility for interfacing with wide buses, numerous peripherals, and multi-lane data paths.
• Commercial-grade operation: Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.
• industry-backed datasheet: Part of the Stratix V GX device family with detailed electrical and switching characteristics provided in the manufacturer datasheet for design validation.

Why Choose 5SGXEA7N1F45C2G?

5SGXEA7N1F45C2G is positioned for engineers who need a high-capacity Stratix V GX FPGA with substantial logic elements, abundant embedded memory, and a high I/O count in a surface-mount FCBGA package. Its electrical supply range and commercial temperature rating support standard commercial system designs that require large programmable resources on a single device.

The device is supported by the Stratix V series documentation and electrical specifications, enabling detailed power and timing analysis during system design and integration.

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