5SGXEA7N1F45C2L
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 51200000 622000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 500 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXEA7N1F45C2L – Stratix® V GX FPGA, 840 I/O, 622k Logic Elements
The 5SGXEA7N1F45C2L is a Stratix V GX field-programmable gate array supplied in a 1932-BBGA FCBGA package. It provides high logic density and substantial on-chip memory for complex programmable designs in commercial-temperature applications.
Key hardware characteristics include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 840 user I/Os. The device is offered as a surface-mount, commercial-grade FPGA with a nominal core supply range of 820 mV to 880 mV.
Key Features
- Core & Logic 622,000 logic elements for implementing large-scale programmable logic and custom silicon functions.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support large buffering, on-chip data storage, and state machines.
- I/O Capacity 840 device I/Os to support dense external interfacing and multi-channel connectivity.
- Power Supply Core voltage requirement from 820 mV to 880 mV, allowing designers to plan power delivery precisely.
- Package & Mounting 1932-BBGA (FCBGA) package; supplier package listed as 1932-FBGA, FC (45 × 45). Surface-mount mounting for standard PCB assembly.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for commercial applications.
- Environmental Compliance RoHS compliant to support environmentally conscious BOM requirements.
Typical Applications
- High-density digital logic – Implement large, deeply pipelined logic networks and custom processing pipelines using the device’s 622k logic elements and abundant on-chip RAM.
- Multi-channel I/O systems – Leverage 840 I/Os to connect multiple peripherals, sensors, or parallel interfaces on a single FPGA.
- Memory-intensive acceleration – Use approximately 51.2 Mbits of embedded memory for buffering, lookup tables, and on-chip data structures in compute- or data-path-heavy designs.
Unique Advantages
- Large programmable capacity: 622,000 logic elements provide the scale required for integrating complex logic and custom IP on a single device, reducing the need for multi-FPGA solutions.
- Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM supports significant local storage, lowering external memory dependency and improving latency.
- High I/O count: 840 I/Os enable broad connectivity and flexible system partitioning for multi-channel and multi-domain designs.
- Compact BGA packaging: 1932-BBGA (FCBGA) with a 45 × 45 supplier footprint provides high pin density in a surface-mount form factor for space-constrained PCBs.
- Commercial-grade operating range: Device rated for 0 °C to 85 °C, matching common commercial deployment requirements.
- RoHS compliant: Meets environmental compliance expectations for modern assemblies.
Why Choose 5SGXEA7N1F45C2L?
The 5SGXEA7N1F45C2L positions itself as a high-capacity, commercial-grade Stratix V GX FPGA suitable for designs that require extensive programmable logic, on-chip memory, and a large number of I/Os in a compact BGA package. Its combination of 622,000 logic elements and approximately 51.2 Mbits of embedded RAM enables consolidation of complex subsystems onto a single device, simplifying board-level design and reducing component count.
Design teams seeking a surface-mount Stratix V GX solution with well-defined supply and thermal limits (820 mV–880 mV core, 0 °C–85 °C) will find this part appropriate for commercial applications where logic density, I/O flexibility, and RoHS compliance are priorities.
Request a quote or contact sales to discuss availability, lead times, and pricing for 5SGXEA7N1F45C2L.

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