5SGXEA7N1F45I2G

The 5SGXEA7N1F45I2G is a Stratix V GX family FPGA manufactured by Intel. It delivers high-density programmable logic with a large embedded memory footprint and a high I/O count for demanding, industrial-grade designs.

Key hardware attributes include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, 840 user I/Os, a 1932-BBGA FCBGA package, surface-mount mounting, and a specified operating voltage range of 870 mV to 930 mV. The device is specified for industrial temperature operation from −40 °C to 100 °C and is RoHS compliant.

Key Features

• Core Logic  622,000 logic elements provide large programmable fabric capacity for complex digital systems and extensive parallelism.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, packet processing, and large lookup tables without external memory.
• I/O Capacity  840 I/O pins enable dense peripheral connectivity and multi-channel interfacing in a single device.
• Package & Mounting  1932-BBGA (FCBGA) package in a 45 × 45 mm footprint with surface-mount mounting for compact, high-density PCB integration.
• Power Supply  Core supply specified between 870 mV and 930 mV to match platform power-rail requirements.
• Industrial Temperature Grade  Rated for −40 °C to 100 °C operation for deployment in industrial environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High‑density networking and communications  Use the large logic and memory resources with high I/O counts for packet processing, protocol offload, and interface aggregation.
• Signal processing and compute acceleration  Leverage the extensive logic fabric and embedded RAM for real‑time data paths, DSP pipelines, and application-specific accelerators.
• Industrial control and automation  Industrial temperature rating and robust I/O make it suitable for control systems, motor drives, and factory automation platforms.
• Board-level consolidation  High integration of logic, memory, and I/O can reduce BOM complexity by replacing multiple discrete components with a single FPGA device.

Unique Advantages

• High integration density: 622,000 logic elements and ~51.2 Mbits of embedded memory consolidate complex functionality on one device, reducing external component count.
• Extensive I/O resources: 840 I/Os enable broad peripheral and multi-channel interfacing without additional multiplexers or I/O expanders.
• Industrial readiness: Specified operation from −40 °C to 100 °C supports deployment in industrial-grade environments and applications.
• Compact BGA package: 1932-BBGA FCBGA provides a dense, surface-mount footprint for space-constrained PCBs while supporting high pin count routing.
• Controlled core voltage: Narrow supply range (870 mV–930 mV) simplifies power-rail design for systems targeting the Stratix V GX core.
• RoHS compliant: Meets common environmental compliance expectations for modern electronics manufacturing.

Why Choose 5SGXEA7N1F45I2G?

The 5SGXEA7N1F45I2G positions itself as a high-capacity, industrial-grade Stratix V GX FPGA option for engineers needing substantial logic, memory, and I/O in a single, compact package. Its combination of 622,000 logic elements, roughly 51.2 Mbits of embedded RAM, and 840 I/Os supports consolidation of complex digital subsystems and high-throughput designs.

Designed for industrial operating ranges and supplied by Intel, this device is suited to customers building scalable, robust systems where integration density and reliable operation across temperature are priorities. Use it where board-area savings, reduced BOM, and extensive on-chip resources deliver measurable design and production advantages.

Request a quote or submit a pricing inquiry today to confirm availability and receive tailored lead-time and pricing information for 5SGXEA7N1F45I2G.