5SGXEA7N2F40C1N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,714 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXEA7N2F40C1N – Stratix® V GX FPGA, 600 I/O, 622,000 logic elements
The 5SGXEA7N2F40C1N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel (Altera) designed for commercial-temperature applications. As a member of the Stratix V GX family, the device provides a large logic fabric, substantial on‑chip memory, and a high I/O count in a 1517‑FBGA surface‑mount package.
This device is intended for designs that require dense programmable logic and extensive I/O capacity while operating within a commercial temperature range and the specified core supply voltage window.
Key Features
- Logic Capacity 622,000 logic elements and 234,720 logic array blocks provide significant programmable logic resources for complex digital designs.
- Embedded Memory Approximately 51.2 Mbits of embedded memory for on‑chip data storage, buffering, and state machines.
- I/O Density 600 device I/Os to support complex board-level interfacing and parallel connectivity requirements.
- Package & Mounting 1517‑BBGA / FCBGA (supplier device package: 1517‑FBGA, 40×40) in a surface‑mount format for board integration.
- Power and Operating Conditions Core supply voltage range of 870 mV to 930 mV and commercial operating temperature of 0 °C to 85 °C.
- Compliance RoHS compliant, meeting common environmental material restrictions for commercial electronics.
- Stratix V GX Family Characteristics Part of the Stratix V GX family described in the device datasheet, which documents transceiver and speed‑grade options for the family.
Typical Applications
- High‑speed serial communication Suited for designs that leverage the Stratix V GX family transceiver capabilities as documented in the device datasheet.
- High‑density digital processing Useful where large numbers of logic elements and substantial on‑chip RAM are required for custom digital functions and packet processing.
- Complex I/O systems Ideal for applications needing hundreds of device I/Os for interfacing to parallel buses, peripherals, or multi‑lane front‑end connectivity.
Unique Advantages
- High logic and routing capacity: 622,000 logic elements and 234,720 logic array blocks enable implementation of large, complex designs on a single device.
- Significant embedded memory: Approximately 51.2 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and storage tasks.
- Large I/O complement: 600 I/Os simplify board-level integration for systems with dense connectivity requirements.
- Commercial temperature rating: Rated for 0 °C to 85 °C to match commercial electronics deployment environments.
- Compact surface-mount package: 1517‑FBGA (40×40) package supports high‑density PCBs and standard surface‑mount assembly processes.
- Manufacturer backing: Part of Intel’s Stratix V family with device-level documentation provided in the Stratix V device datasheet.
Why Choose 5SGXEA7N2F40C1N?
The 5SGXEA7N2F40C1N positions itself as a high‑capacity, commercially rated Stratix V GX FPGA option for designs that demand extensive programmable logic, large embedded memory, and a broad I/O set in a compact surface‑mount package. Its core supply voltage window and commercial temperature rating make it appropriate for mainstream electronic products and systems that rely on Intel’s Stratix V device documentation for design guidance.
This device is suited to engineering teams building complex digital systems that benefit from on‑chip memory, dense logic resources, and substantial I/O — while remaining within commercial operating conditions and RoHS environmental requirements.
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