5SGXEA7N1F45I2N

The 5SGXEA7N1F45I2N is a Stratix® V GX field-programmable gate array (FPGA) IC offered in an industrial temperature grade. It provides very large logic capacity, extensive on‑chip RAM, and a high I/O count in a 1932‑ball FCBGA package for high-density board designs.

Per the Stratix V device family datasheet, Stratix V GX devices are available across transceiver and core speed grades; the family includes transceiver speed grades documented up to 14.1 Gbps. This device is specified with key electrical and mechanical characteristics suitable for industrial-temperature FPGA applications.

Key Features

• Logic Capacity — 622,000 logic elements and 234,720 logic blocks provide very large programmable fabric for complex designs.
• Embedded Memory — Approximately 51.2 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage.
• I/O Density — 840 user I/Os to support wide parallel interfaces and multiple peripherals.
• Package & Mounting — 1932‑BBGA (FCBGA) package; supplier device package noted as 1932‑FBGA, FC (45×45); surface‑mount device.
• Power Supply — Core voltage supply range specified at 870 mV to 930 mV.
• Temperature Grade — Industrial operating temperature range from −40 °C to 100 °C.
• Compliance — RoHS‑compliant.
• Family Transceiver Capability — Stratix V GX family transceiver speed grades are documented in the device datasheet (family entries include GX channel grades up to 14.1 Gbps and other supported grades).

Typical Applications

• Industrial control and automation — Industrial temperature rating and high I/O count enable deployment in control systems that require robust operation across −40 °C to 100 °C.
• High‑density custom logic — Large logic element count and substantial on‑chip RAM support complex, compute‑intensive FPGA designs and custom accelerators.
• High‑performance interface bridging — High I/O density and Stratix V GX family transceiver capabilities (per datasheet) suit designs that aggregate multiple high‑speed and parallel interfaces.

Unique Advantages

• Extensive programmable fabric: 622,000 logic elements and 234,720 logic blocks deliver the scale needed for large HDL designs and system integration on a single device.
• Significant on‑chip RAM: Approximately 51.2 Mbits of embedded memory reduces external memory dependency for buffering and on‑chip data handling.
• High I/O count: 840 I/Os simplify board‑level routing of multiple interfaces and peripherals without external expander logic.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C addresses thermally demanding environments.
• Compact, high‑ball‑count package: 1932‑FBGA FCBGA package (45×45) concentrates resources in a compact footprint for high‑density PCB designs.
• Controlled core voltage range: 0.87–0.93 V core supply specification supports precise power sequencing and design planning.

Why Choose 5SGXEA7N1F45I2N?

The 5SGXEA7N1F45I2N positions itself as a high‑capacity Stratix V GX FPGA for industrial‑grade designs that demand large programmable logic, a substantial amount of embedded RAM, and a high I/O count in a dense FCBGA package. Its documented family transceiver capabilities and industrial temperature rating make it appropriate where both performance and extended temperature operation are required.

Engineers specifying this device will find a combination of scale and ruggedness suitable for complex system integration, high‑density logic consolidation, and designs that benefit from significant on‑chip memory and I/O resources.

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