5SGXEA7N2F40C1G

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA

Quantity 890 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7N2F40C1G – Stratix® V GX Field Programmable Gate Array (FPGA), 622,000 logic elements

The 5SGXEA7N2F40C1G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC optimized for designs that require very high logic density, extensive on‑chip RAM, and a large I/O count. Built on the Stratix V GX family architecture, this commercial‑grade device delivers a combination of programmable logic capacity, embedded memory, and packaging suitable for complex, high‑density systems.

Key differentiators for system architects include a large logic element count, approximately 51.2 Mbits of embedded RAM, and up to 600 user I/Os — all in a 1517‑ball FCBGA package with surface‑mount mounting.

Key Features

  • Core Logic — 622,000 logic elements (cells) provide substantial programmable logic resources for large FPGA designs.
  • Embedded Memory — Approximately 51.2 Mbits of on‑chip RAM to support large buffers, FIFOs, and memory‑intensive logic functions.
  • I/O Capacity — 600 user I/Os to accommodate dense board‑level connectivity and multiple high‑pin interfaces.
  • Package and Mounting — 1517‑BBGA, FCBGA package (supplier package: 1517‑FBGA 40×40) with surface mount assembly for compact, high‑density PCB designs.
  • Power Supply — Core voltage supply range of 870 mV to 930 mV for the device core.
  • Operating Range — Commercial temperature grade with operating temperature from 0 °C to 85 °C.
  • Compliance — RoHS compliant.
  • Series Transceiver Capability (series datasheet) — The Stratix V GX family datasheet documents GX transceiver speed grades (series‑level information) up to 14.1 Gbps, as applicable to the Stratix V GX family.

Typical Applications

  • High‑density logic designs — Use where hundreds of thousands of logic elements and abundant on‑chip RAM are required to implement complex RTL and compute pipelines.
  • High‑I/O systems — Ideal for boards and modules that require up to 600 I/Os for broad interface and peripheral integration.
  • Embedded processing and buffering — The substantial embedded RAM supports data buffering, packet queues, and memory‑intensive logic functions.

Unique Advantages

  • High programmable density: 622,000 logic elements enable implementation of large, feature‑rich designs without external logic expansion.
  • Significant on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
  • Extensive I/O count: 600 user I/Os provide flexibility to connect multiple interfaces, sensors, and peripherals directly to the FPGA.
  • Compact, production‑ready packaging: 1517‑BBGA FCBGA (40×40) package in a surface‑mount form factor supports dense PCB routing and assembly processes.
  • Commercial temperature grading: Rated 0 °C to 85 °C for standard commercial environments.
  • Regulatory readiness: RoHS compliance supports environmental and regulatory requirements for many product lines.

Why Choose 5SGXEA7N2F40C1G?

The 5SGXEA7N2F40C1G positions itself for designs that demand large programmable logic capacity, substantial on‑chip RAM, and broad I/O capability within a compact FCBGA package. As a member of the Stratix V GX family, it aligns series‑level high‑performance transceiver capabilities with a commercial‑grade footprint suitable for complex system designs.

Designers and procurement teams looking for scalability, high integration, and production‑grade packaging will find this device suitable for dense FPGA implementations where logic resources, embedded memory, and I/O count are primary drivers of component selection.

Request a quote or submit an inquiry to get availability, pricing, and lead‑time information for the 5SGXEA7N2F40C1G.Provide your requirements and our team will assist with the next steps.

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