5SGXEA7N2F40C2

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA

Quantity 830 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7N2F40C2 – Stratix® V GX Field Programmable Gate Array (FPGA) IC, 600 I/Os, 622000 logic elements

The 5SGXEA7N2F40C2 is a Stratix® V GX series Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1517-BBGA FCBGA package. Built for high-density programmable logic applications, this device delivers a large logic fabric, substantial on-chip memory, and extensive I/O capability for complex system designs.

Designed for commercial-grade applications, the device targets use cases that require significant logic resources, abundant embedded memory, and high pin-count interfacing, while operating at a low-voltage core supply for optimized board-level power planning.

Key Features

  • Core & Logic — 622,000 logic elements provide substantial programmable fabric for complex digital designs and large-scale integration.
  • Embedded Memory — Approximately 51.2 Mbits of total on-chip RAM to support data buffering, state storage, and memory-intensive logic functions.
  • I/O Capacity — 600 device I/Os for high-pin-count interfacing to peripherals, transceivers, and multi-domain system components.
  • Power — Core voltage supply specified from 870 mV to 930 mV to guide power delivery network design and core regulator selection.
  • Package & Mounting — 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40); surface-mountable for modern PCB assembly processes.
  • Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
  • Compliance — RoHS compliant to support environmental and regulatory requirements.

Typical Applications

  • High-density embedded systems — Use the large logic element count and embedded memory to implement complex SoC-like functions and compute pipelines.
  • I/O‑intensive interfaces — The 600 I/Os enable bridging, protocol conversion, and multi-channel interfacing in communication or instrumentation designs.
  • Prototyping and system integration — Ideal for evaluating and integrating large FPGA designs that require significant on-chip resources and pin count.
  • Memory-centric logic — On-chip RAM supports buffering, FIFO structures, and state machines for data path and control logic implementations.

Unique Advantages

  • High logic capacity: 622,000 logic elements allow consolidation of multiple functions into a single device, reducing board-level complexity.
  • Significant on‑chip memory: Approximately 51.2 Mbits of embedded RAM supports large data structures and reduces dependence on external memory.
  • Extensive I/O count: 600 I/Os provide flexibility for multi‑module connectivity and dense peripheral integration.
  • Compact BGA packaging: 1517-BBGA (FCBGA) in a 40×40 supplier footprint supports space-constrained board designs while maintaining high pin density.
  • Low-voltage core: Core supply specified between 870 mV and 930 mV enables efficient power budgeting and regulator selection.
  • Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial product deployments.

Why Choose 5SGXEA7N2F40C2?

The 5SGXEA7N2F40C2 positions itself as a high-capacity FPGA solution for commercial applications that require a large programmable fabric, abundant embedded memory, and a high number of I/Os in a compact BGA package. Its combination of logic density, on‑chip RAM, and a 600-pin I/O interface makes it suitable for developers consolidating complex digital functions and high-pin-count I/O subsystems onto a single device.

Backed by Intel's Stratix V GX lineage, this device is appropriate for engineering teams and procurement groups looking for a commercially graded FPGA with clearly specified electrical, thermal, and packaging parameters to support robust design planning and long-term product roadmaps.

Request a quote or submit a purchase inquiry for 5SGXEA7N2F40C2 to begin pricing and availability evaluation for your project.

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