5SGXEA7N2F40C2
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 830 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXEA7N2F40C2 – Stratix® V GX Field Programmable Gate Array (FPGA) IC, 600 I/Os, 622000 logic elements
The 5SGXEA7N2F40C2 is a Stratix® V GX series Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1517-BBGA FCBGA package. Built for high-density programmable logic applications, this device delivers a large logic fabric, substantial on-chip memory, and extensive I/O capability for complex system designs.
Designed for commercial-grade applications, the device targets use cases that require significant logic resources, abundant embedded memory, and high pin-count interfacing, while operating at a low-voltage core supply for optimized board-level power planning.
Key Features
- Core & Logic — 622,000 logic elements provide substantial programmable fabric for complex digital designs and large-scale integration.
- Embedded Memory — Approximately 51.2 Mbits of total on-chip RAM to support data buffering, state storage, and memory-intensive logic functions.
- I/O Capacity — 600 device I/Os for high-pin-count interfacing to peripherals, transceivers, and multi-domain system components.
- Power — Core voltage supply specified from 870 mV to 930 mV to guide power delivery network design and core regulator selection.
- Package & Mounting — 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40); surface-mountable for modern PCB assembly processes.
- Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
- Compliance — RoHS compliant to support environmental and regulatory requirements.
Typical Applications
- High-density embedded systems — Use the large logic element count and embedded memory to implement complex SoC-like functions and compute pipelines.
- I/O‑intensive interfaces — The 600 I/Os enable bridging, protocol conversion, and multi-channel interfacing in communication or instrumentation designs.
- Prototyping and system integration — Ideal for evaluating and integrating large FPGA designs that require significant on-chip resources and pin count.
- Memory-centric logic — On-chip RAM supports buffering, FIFO structures, and state machines for data path and control logic implementations.
Unique Advantages
- High logic capacity: 622,000 logic elements allow consolidation of multiple functions into a single device, reducing board-level complexity.
- Significant on‑chip memory: Approximately 51.2 Mbits of embedded RAM supports large data structures and reduces dependence on external memory.
- Extensive I/O count: 600 I/Os provide flexibility for multi‑module connectivity and dense peripheral integration.
- Compact BGA packaging: 1517-BBGA (FCBGA) in a 40×40 supplier footprint supports space-constrained board designs while maintaining high pin density.
- Low-voltage core: Core supply specified between 870 mV and 930 mV enables efficient power budgeting and regulator selection.
- Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial product deployments.
Why Choose 5SGXEA7N2F40C2?
The 5SGXEA7N2F40C2 positions itself as a high-capacity FPGA solution for commercial applications that require a large programmable fabric, abundant embedded memory, and a high number of I/Os in a compact BGA package. Its combination of logic density, on‑chip RAM, and a 600-pin I/O interface makes it suitable for developers consolidating complex digital functions and high-pin-count I/O subsystems onto a single device.
Backed by Intel's Stratix V GX lineage, this device is appropriate for engineering teams and procurement groups looking for a commercially graded FPGA with clearly specified electrical, thermal, and packaging parameters to support robust design planning and long-term product roadmaps.
Request a quote or submit a purchase inquiry for 5SGXEA7N2F40C2 to begin pricing and availability evaluation for your project.

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