5SGXEA7N2F40C2LN

The 5SGXEA7N2F40C2LN is a Stratix V GX FPGA IC from Intel, offered in a 1517-BBGA FCBGA package. This commercial-grade FPGA provides a high logic capacity and large on-chip RAM to support dense, complex FPGA designs.

Designed for applications that require substantial programmable logic, abundant I/O, and family-level multi‑Gbps transceiver options, the device delivers a combination of logic density, embedded memory, and I/O resources in a surface-mount FCBGA package.

Key Features

• High logic capacity  Provides 622,000 logic elements (logic cells) for complex digital designs and large-scale integration.
• Significant embedded memory  Includes approximately 51.2 Mbits of on-chip RAM to support buffering, state storage, and data processing tasks.
• Extensive I/O  Offers 600 I/O pins to accommodate high‑pin‑count interfaces and dense board-level connectivity.
• Package and mounting  Delivered in a 1517-BBGA (FCBGA) package, supplier device package listed as 1517-FBGA (40×40); surface-mount mounting type.
• Power supply  Core voltage supply range specified at 820 mV to 880 mV for core power planning and regulator selection.
• Operating temperature  Commercial grade operation from 0 °C to 85 °C.
• Standards compliance  RoHS compliant.
• Stratix V GX family transceiver grades  Stratix V GX family documentation lists transceiver speed-grade options (for family reference) including channels rated at up to 14.1 Gbps and 12.5 Gbps, indicating available high-speed serial capability within the GX family.

Typical Applications

• High‑density FPGA designs  Large logic capacity (622k logic elements) makes this device suitable for implementations that require substantial programmable logic, such as complex state machines, protocol engines, or large combinational/sequential logic blocks.
• Memory‑intensive functions  Approximately 51.2 Mbits of embedded RAM supports on‑chip buffering, lookup tables, and data‑path storage for DSP and packet processing tasks.
• High‑pin‑count interface systems  With 600 I/Os, the device supports designs that integrate numerous parallel interfaces, external memory buses, or multiple peripheral connections.
• Commercial temperature deployments  Specified for 0 °C to 85 °C operation for standard commercial environments and applications.

Unique Advantages

• Scalable logic capacity: 622,000 logic elements provide the headroom to consolidate multiple functions into a single FPGA, reducing system complexity.
• Large embedded memory: Approximately 51.2 Mbits of on‑chip RAM reduces dependence on external memory and improves data throughput for packet buffering and streaming applications.
• High I/O density: 600 I/Os simplify board routing for multi‑interface systems and enable direct connections to numerous peripherals and parallel data paths.
• Compact FCBGA packaging: 1517‑BBGA (1517‑FBGA, 40×40) offers a dense package footprint for high‑performance designs while supporting surface‑mount assembly processes.
• Defined core voltage window: 820–880 mV core supply range allows precise power budgeting and regulator selection for optimized power delivery.
• RoHS compliance: Meets RoHS requirements for materials compliance in commercial electronic products.

Why Choose 5SGXEA7N2F40C2LN?

The 5SGXEA7N2F40C2LN combines a high logic element count, substantial on‑chip RAM, and a large complement of I/Os in a compact FCBGA package, making it suitable for engineers who need to integrate dense digital logic and memory on a single device. Its commercial temperature rating and defined supply requirements simplify system-level integration for standard commercial products.

This part is appropriate for teams building complex FPGA-based subsystems that benefit from the Stratix V GX family’s documented transceiver speed grades and family-level characteristics, while taking advantage of Intel’s Stratix V device documentation for hardware design and validation.

Request a quote or submit an inquiry to receive pricing and availability information for 5SGXEA7N2F40C2LN and to discuss how this device can fit into your next design.