5SGXEA7N2F40C3G

The 5SGXEA7N2F40C3G is a Stratix® V GX field programmable gate array (FPGA) IC delivering large programmable logic capacity and substantial embedded memory in a FCBGA package. This commercial-grade device integrates 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and up to 600 user I/O pins for dense system integration.

Designed for applications that require high logic density and extensive I/O, the device combines a low-voltage core supply range with a compact 1517-BBGA (1517-FBGA, 40×40) package and surface-mount mounting for streamlined board-level implementation.

Key Features

• Logic Density  622,000 logic elements for implementing large digital designs and complex programmable logic.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, packet storage, and deep on-chip data structures.
• High I/O Count  600 user I/O pins to support broad interfacing and parallel system connectivity.
• Low-Voltage Core  Core supply range from 820 mV to 880 mV to match modern low-voltage FPGA power domains.
• Package & Mounting  1517-BBGA FCBGA package (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for board-level integration.
• Commercial Grade Temperature  Rated for operation from 0 °C to 85 °C, compatible with commercial-environment deployments.
• RoHS Compliance  Device is RoHS compliant.

Typical Applications

• High-density logic integration  Use the device to implement large programmable logic designs requiring hundreds of thousands of logic elements and significant on-chip RAM.
• Multi‑I/O systems  Leverage the 600 I/O pins for designs that demand extensive parallel interfacing or multiple peripheral buses.
• Embedded data buffering  Take advantage of approximately 51.2 Mbits of embedded memory for packet buffering, FIFOs, and on-chip storage.

Unique Advantages

• High integration density: 622,000 logic elements combined with large embedded RAM reduce the need for external logic and memory components.
• Extensive I/O capability: 600 I/O pins enable broad peripheral and system interfacing without additional IO expander devices.
• Compact FCBGA package: 1517-BBGA (1517-FBGA, 40×40) provides a high‑pin-count solution in a compact surface-mount footprint for space‑constrained boards.
• Low-voltage core operation: Core supply between 820 mV and 880 mV supports integration with modern low-voltage power architectures.
• Commercial temperature rating: 0 °C to 85 °C operation aligns the device to commercial applications and standard electronics environments.
• Standards‑aware supply chain: RoHS compliance supports designs targeting regulated markets and environmental requirements.

Why Choose 5SGXEA7N2F40C3G?

The 5SGXEA7N2F40C3G positions itself for projects that demand high logic density, substantial on-chip memory, and extensive I/O in a compact FCBGA package. Its combination of 622,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 600 I/Os provides a platform for consolidating functionality on a single device and simplifying system design.

This commercial-grade Stratix V GX device is suited to design teams and procurement channels seeking a high-capacity FPGA with defined electrical and thermal operating windows, RoHS compliance, and a compact surface-mount package for efficient PCB integration.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and support for the 5SGXEA7N2F40C3G.