5SGXEA7N2F40C3

The 5SGXEA7N2F40C3 is a Stratix® V GX field programmable gate array (FPGA) in a 1517-BBGA (FCBGA) package intended for commercial-grade applications. It integrates a high logic capacity FPGA fabric with substantial embedded RAM and a large number of I/O pins to support complex digital designs and high-density integrations.

Designed for surface-mount PCB assembly, this device offers a core supply operating window of 820 mV to 880 mV and an ambient operating temperature range of 0 °C to 85 °C, making it suitable for commercial electronic systems that require significant logic, memory, and I/O resources in a compact package.

Key Features

• Logic Capacity  622,000 logic elements (cells) to implement large-scale digital designs and custom logic partitions.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, frame storage, and data-path implementations.
• Rich I/O  600 I/O pins to support dense connectivity and multiple parallel interfaces.
• Package & Mounting  1517-FBGA (40×40) package in a 1517-BBGA (FCBGA) format with surface-mount mounting for compact system layouts.
• Power  Core voltage supply range from 820 mV to 880 mV to match system power-rail planning and regulation designs.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation and designated as Commercial grade for standard electronic products.
• Family-level Documentation  Datasheet coverage for the Stratix V family provides electrical and switching characteristics, I/O timing, and operating condition guidance for design implementation.

Typical Applications

• High-density digital systems  Implement large, custom logic functions and complex control systems using the device's extensive logic and embedded RAM.
• Multi-channel I/O aggregation  Aggregate and manage many parallel interfaces or sensor/data lanes using up to 600 I/O pins for system-level connectivity.
• Prototyping and system integration  Use the Stratix V GX device for prototyping high-capacity FPGA designs or integrating custom IP with substantial on-chip memory.

Unique Advantages

• Large programmable fabric: 622,000 logic elements enable complex, partitioned designs and higher gate-equivalent implementations without external logic.
• Significant on-chip RAM: Approximately 51.2 Mbits of embedded memory reduces dependence on external memory for buffering and local storage.
• Extensive I/O availability: 600 I/Os simplify board-level routing and reduce the need for additional I/O expanders or interface chips.
• Compact surface-mount FBGA package: 1517-FBGA (40×40) package provides a high-density footprint for space-constrained designs.
• Defined commercial operating window: Commercial temperature grade (0 °C to 85 °C) and a specified core voltage range (820–880 mV) support predictable system power and thermal planning.

Why Choose 5SGXEA7N2F40C3?

The 5SGXEA7N2F40C3 delivers a combination of high logic density, substantial embedded memory, and a large I/O count in a compact FBGA package for commercial electronic systems. Its defined operating voltage and temperature range make it straightforward to integrate into designs that prioritize on-chip resources and dense connectivity.

This device is well suited for engineering teams building complex digital systems that require significant programmable fabric and memory capacity while maintaining a compact board footprint and standard commercial-grade operating conditions. Supportive Stratix V family documentation provides the electrical and timing information needed for system-level implementation and validation.

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