5SGXEA7N2F40C3N

The 5SGXEA7N2F40C3N is a Stratix® V GX field programmable gate array (FPGA) IC provided in a 1517-BBGA (1517-FBGA, 40×40) FCBGA package for surface-mount applications. The device delivers a high logic capacity with 622,000 logic elements and approximately 51.2 Mbits of embedded memory while exposing 600 I/O pins for broad system connectivity.

Targeted at commercial-grade designs, this Stratix V GX device operates from a core supply range of 820 mV to 880 mV and is specified for use over a 0 °C to 85 °C operating range. Series documentation covers electrical and switching characteristics including I/O timing and transceiver specifications for the Stratix V family.

Key Features

• High Logic Capacity  622,000 logic elements (LEs) provide the fabric required for large-scale custom logic, protocol engines, and complex control functions.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM supports large buffering, state storage, and fast local data access without external memory.
• Extensive I/O  600 I/O pins enable dense interfacing to peripherals, parallel buses, and board-level connectors for systems requiring high pin counts.
• Package & Mounting  1517-BBGA (1517-FBGA, 40×40) FCBGA package designed for surface-mount assembly in compact board layouts.
• Power  Core supply voltage specified between 820 mV and 880 mV to support proper core operation within defined electrical characteristics.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, suitable for commercial electronics and controlled-environment systems.
• Series-Level Transceiver & I/O Details  Stratix V series documentation provides electrical and switching characteristics, including I/O timing and transceiver specifications relevant to high-speed link design.
• RoHS Compliant  Device meets RoHS requirements for lead-free designs.

Typical Applications

• High-density digital processing  Large logic and memory resources support complex data-paths, custom accelerators, and protocol implementation.
• I/O-intensive systems  With 600 I/O pins, the device is suited for designs requiring extensive board-level interfacing or multi-channel front-ends.
• Communications and protocol handling  Series-level transceiver and I/O timing details in the Stratix V family make these devices applicable where high-speed serial links and precise timing are required.
• System prototyping and integration  On-chip resources and a compact FCBGA package enable integration of complex subsystems for prototype and production hardware.

Unique Advantages

• Substantial on-chip resources:  622,000 logic elements and approximately 51.2 Mbits of embedded RAM reduce reliance on external logic and memory, simplifying board design.
• High I/O count:  600 I/Os allow for dense peripheral and bus connections without additional I/O expanders.
• Compact package footprint:  1517-FBGA (40×40) FCBGA package balances high pin count with a compact board area.
• Commercial-ready temperature range:  Specified 0 °C to 85 °C operation aligns with standard commercial product requirements.
• Clear electrical characterization:  Series datasheet details operating conditions, power, and switching characteristics to support reliable design and validation.
• RoHS compliance:  Facilitates use in lead-free manufacturing flows.

Why Choose 5SGXEA7N2F40C3N?

The 5SGXEA7N2F40C3N delivers a high-density Stratix V GX FPGA solution that consolidates large logic capacity, substantial embedded memory, and a broad I/O complement into a compact FCBGA package. Its defined core voltage range and commercial temperature specification make it suitable for professional, production-grade electronic systems where integration and board-level connectivity are priorities.

This device is appropriate for design teams implementing complex digital logic, protocol processing, and I/O-heavy subsystems that benefit from substantial on-chip resources and the detailed electrical and switching guidance provided by the Stratix V series documentation.

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