5SGXEA7N2F40I2LG

The 5SGXEA7N2F40I2LG is a Stratix® V GX field programmable gate array (FPGA) in a 1517-BBGA FCBGA package designed for high-density, I/O-rich FPGA implementations. This device combines a large logic fabric with substantial on-chip memory and a high I/O count, making it suitable for complex digital processing and dense system integration in industrial temperature environments.

Key Features

• Logic Capacity  622,000 logic elements provide a high-density programmable fabric for complex logic, control, and custom processing functions.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, FIFOs, and data path storage without external memory dependency.
• I/O Resources  600 I/Os enable extensive peripheral interfacing and dense board-level connectivity for multi-channel systems.
• Package and Mounting  1517-BBGA (1517-FBGA, 40×40) FCBGA package with surface-mount mounting type for compact, board-level integration.
• Power  Core voltage supply range of 820 mV to 880 mV to match system power-rail planning and core power budgets.
• Temperature and Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Regulatory Compliance  RoHS compliant to support environmental and manufacturing requirements.
• Stratix V GX Family  Part of the Stratix V GX device family (device-level electrical and switching characteristics described in the Stratix V device datasheet).

Typical Applications

• High-density logic designs  Implement large-scale, custom digital architectures that require hundreds of thousands of logic elements.
• Memory-intensive FPGA functions  Use the on-chip RAM (approximately 51.2 Mbits) for buffering, packet processing, and data staging without immediate external memory.
• I/O-heavy systems  600 I/Os allow dense interfacing to front-end electronics, sensors, and multiple peripheral buses.
• Industrial deployments  Industrial temperature rating (−40 °C to 100 °C) supports applications that require extended temperature operation.

Unique Advantages

• High logic density: 622,000 logic elements allow consolidation of large designs onto a single device, reducing board count and interconnect complexity.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory and simplifies memory subsystem design.
• Extensive I/O capacity: 600 I/Os provide flexibility for multi-channel designs and complex interfacing requirements.
• Industrial-grade robustness: Specified operation from −40 °C to 100 °C enables reliable use in industrial environments.
• Compact packaging: 1517-BBGA FCBGA package supports high-density PCB layouts while providing a surface-mount solution.
• Low-voltage core operation: Core supply range of 820–880 mV aligns with modern low-voltage system architectures.

Why Choose 5SGXEA7N2F40I2LG?

The 5SGXEA7N2F40I2LG delivers a combination of large logic capacity, significant embedded memory, and a high I/O count in a compact FCBGA package targeted at demanding, high-density FPGA designs. Its industrial temperature rating and RoHS compliance make it a suitable option for long-life industrial systems where board-level integration density and on-chip resources are priorities.

This part is well suited for teams and projects seeking a single-device solution to consolidate complex logic, memory buffering, and extensive I/O without relying solely on external components. The device’s power and package characteristics support integration into modern, cost-sensitive board designs while aligning with industrial environmental requirements.

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