5SGXEA7N2F40I3

The 5SGXEA7N2F40I3 is a Stratix V GX field programmable gate array (FPGA) in an industrial-grade package. It provides a high-density programmable logic fabric with a large embedded memory pool, a substantial I/O count, and a compact 1517-BBGA (FCBGA) surface-mount package.

This device is suited to designs that require extensive on-chip logic, significant embedded RAM, and broad external connectivity while operating across an industrial temperature range.

Key Features

• High Logic Capacity  622,000 logic elements (cells) to implement complex digital designs and large-scale custom logic functions.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive processing tasks.
• Extensive I/O  600 general-purpose I/Os to support dense peripheral interfacing and high pin-count system integrations.
• Power/Voltage  Core voltage supply range specified at 820 mV to 880 mV for the device core operating conditions.
• Package & Mounting  1517-BBGA (FCBGA) surface-mount package with supplier device package listed as 1517-FBGA (40×40), optimized for space-constrained boards.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet harsher environmental requirements.
• Regulatory Status  RoHS compliant.

Typical Applications

• High-density digital systems  Implement complex custom logic and control functions using the device's 622,000 logic elements.
• Memory-intensive processing  Use the approximately 51.2 Mbits of embedded RAM for buffering, packet processing, or DSP-related on-chip storage.
• I/O-rich platforms  Leverage 600 I/Os for multi-channel interfaces, dense sensor arrays, or extensive peripheral connectivity.
• Industrial equipment  Deploy in systems that require operation across −40 °C to 100 °C while maintaining product-level density and I/O capability.

Unique Advantages

• Large programmable fabric: 622,000 logic elements deliver the capacity to consolidate multiple functions into a single device, reducing BOM and board complexity.
• Substantial on-chip RAM: Approximately 51.2 Mbits of embedded memory supports local buffering and high-throughput data handling without external memory dependence.
• High I/O count: 600 I/Os enable broad system interfacing and flexible routing for complex designs.
• Industrial temperature support: Rated −40 °C to 100 °C for reliable operation in demanding environments.
• Compact, manufacturable package: 1517-BBGA (FCBGA) surface-mount footprint (1517-FBGA, 40×40) supports dense PCB layouts and automated assembly.
• Standards-ready compliance: RoHS compliance simplifies regulatory alignment for modern electronics manufacturing.

Why Choose 5SGXEA7N2F40I3?

The 5SGXEA7N2F40I3 positions itself as a high-capacity Stratix V GX FPGA offering a combination of large logic resources, significant embedded RAM, and extensive I/O in a compact industrial-grade FCBGA package. Its specified core voltage range and wide operating temperature make it suitable for demanding system designs that require both density and environmental robustness.

This device is well suited for engineering teams consolidating functions, minimizing external memory, and integrating many external interfaces on a single programmable device while relying on a known FPGA architecture and supporting documentation.

Request a quote or submit an inquiry to obtain pricing and availability for the 5SGXEA7N2F40I3 and to discuss how it fits your next high-density FPGA design.