5SGXEA7N2F40I3LG

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA

Quantity 861 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7N2F40I3LG – Stratix® V GX FPGA, 622,000 Logic Elements, ~51.2 Mbits RAM, 600 I/Os, 1517-BBGA

The 5SGXEA7N2F40I3LG is a Stratix® V GX Field Programmable Gate Array (FPGA) in a 1517-BBGA FCBGA package designed for high-density, high-I/O programmable logic implementations. It combines substantial logic capacity and on-chip memory with a high I/O count and an industrial operating temperature range to support demanding embedded and system-level designs.

This device is targeted at designs that require large programmable logic arrays, significant embedded memory, and a high pin count for complex interfacing and data routing while operating across industrial temperature conditions.

Key Features

  • Logic capacity — 622,000 logic elements distributed across 234,720 logic blocks, enabling implementation of sizable custom logic, datapaths, and control functions.
  • Embedded memory — approximately 51.2 Mbits of on-chip RAM for large buffers, FIFOs, and memory-mapped logic functions without immediate reliance on external memory.
  • I/O resources — 600 user I/O pins, providing extensive connectivity for multi-channel interfaces, parallel buses, and high-pin-count subsystems.
  • Power and core voltage — core supply range specified between 0.820 V and 0.880 V, supporting defined power-rail design and delivery for the device.
  • Package and mounting — 1517-BBGA (FCBGA) supplier package 1517-FBGA (40×40), surface-mount package that supports high pin density in a compact footprint.
  • Temperature and grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
  • RoHS compliance — device is RoHS compliant.
  • Part of the Stratix V GX family — benefits from the family-level electrical and transceiver characteristics documented for Stratix V GX devices in the device datasheet.

Typical Applications

  • High-performance data processing — Implement large datapaths, parallel accelerators, and custom processing engines using the device’s extensive logic and embedded memory.
  • Multi-channel I/O systems — Support high-channel-count front-ends or backplane interfaces with up to 600 user I/Os for dense board-level connectivity.
  • Industrial control and automation — Deploy in industrial systems that require an industrial temperature range and robust programmable logic for control, timing, and interface bridging.
  • Complex protocol bridging and glue logic — Replace multi-chip glue with programmable logic that consolidates interfaces and buffering using the on-chip RAM and abundant I/O.

Unique Advantages

  • High logic density: 622,000 logic elements provide the capacity to integrate large portions of a system into a single FPGA, reducing component count.
  • Substantial on‑chip RAM: Approximately 51.2 Mbits of embedded memory reduces dependence on external memory for buffers and state storage, simplifying board design.
  • Extensive I/O count: 600 I/Os enable direct interfacing to numerous peripherals and high-channel-count systems without additional I/O expanders.
  • Industrial temperature range: Rated for −40 °C to 100 °C to meet the environmental range required by many industrial applications.
  • Compact, high‑pin package: 1517-BBGA (FCBGA) 40×40 package supports a high pin count in a manageable PCB area for dense designs.
  • Defined core-voltage window: 0.820 V–0.880 V core supply simplifies power-supply planning for the device core domain.

Why Choose 5SGXEA7N2F40I3LG?

The 5SGXEA7N2F40I3LG delivers a combination of high logic capacity, significant embedded memory, and a high I/O count in a single industrial-grade FCBGA package. Its specifications make it well suited for designs that consolidate complex logic, buffering, and multi-channel interfacing into a single programmable device.

For engineers and procurement teams building scalable, robust systems that must operate across extended temperature ranges, this Stratix V GX FPGA provides the hardware foundation to reduce board-level complexity while leveraging the documented family-level electrical and transceiver characteristics defined in the Stratix V GX device documentation.

Request a quote or submit a procurement inquiry today to evaluate how the 5SGXEA7N2F40I3LG can meet your project’s high-density programmable logic and I/O requirements.

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