5SGXEA7N2F40I3LN

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA

Quantity 467 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7N2F40I3LN – Stratix® V GX FPGA, 622,000 Logic Elements, 600 I/Os

The 5SGXEA7N2F40I3LN is a Stratix V GX family Field Programmable Gate Array (FPGA) optimized for industrial applications that require large programmable logic capacity and extensive I/O. This device integrates 622,000 logic elements and approximately 51.2 Mbits of embedded memory, making it suitable for complex digital processing, high-channel I/O aggregation, and large-system integration.

Packaged in a 1517-BBGA FCBGA form and designed for surface-mount assembly, the device operates over an industrial temperature range and supports a low-voltage core supply, enabling dense, reliable designs in industrial environments.

Key Features

  • Core Logic  622,000 logic elements provide substantial programmable fabric for large-scale digital designs and complex algorithm implementation.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and on-chip data structures to support high-throughput processing.
  • I/O Density & Packaging  600 general-purpose I/Os delivered from a 1517-BBGA (FCBGA) package; supplier package listed as 1517-FBGA (40×40), suitable for high-pin-count board designs.
  • Power  Specified voltage supply range of 820 mV to 880 mV for the core, enabling predictable power budgeting for system designs.
  • Thermal & Operating Range  Industrial operating temperature range from −40 °C to 100 °C for deployment in industrial environments.
  • Mounting & Form Factor  Surface-mount package simplifies PCB assembly and supports compact multichip board layouts.
  • Regulatory  RoHS compliant.

Typical Applications

  • Industrial Control Systems  Large programmable fabric and extended temperature range support complex control algorithms, deterministic I/O handling, and on-site processing in industrial equipment.
  • Communications & Networking  High logic capacity and extensive I/O count enable protocol processing, packet handling, and interface aggregation in networking and communications infrastructure.
  • Data Processing & Acceleration  Substantial embedded memory and logic resources allow for offloading compute-intensive kernels and implementing custom accelerators for data-center or edge compute tasks.
  • Imaging & Video Systems  Large on-chip RAM and logic resources support multi-channel video processing, image conditioning, and real-time data handling pipelines.

Unique Advantages

  • High Logic Density: 622,000 logic elements reduce the need for multiple FPGAs by consolidating complex functions into a single device.
  • Significant On-Chip Memory: Approximately 51.2 Mbits of embedded RAM enable efficient buffering and low-latency data paths without external memory for many use cases.
  • Extensive I/O Count: 600 I/Os facilitate direct interfacing to numerous peripherals, sensors, and high-channel-count systems.
  • Industrial Temperature Rating: −40 °C to 100 °C operation allows deployment in harsh or temperature-variable environments.
  • Compact, High-Pin Package: 1517-BBGA (FCBGA) package with a 1517-FBGA (40×40) supplier footprint supports high-density board designs while maintaining manageable form factor.
  • Low-Voltage Core: Core supply range of 820–880 mV helps designers plan power delivery and thermal management precisely.

Why Choose 5SGXEA7N2F40I3LN?

The 5SGXEA7N2F40I3LN delivers a large programmable fabric and substantial embedded memory in an industrial-grade Stratix V GX device. Its combination of 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 600 I/Os makes it well suited for demanding digital signal processing, high-channel I/O aggregation, and complex control applications where a single, high-density FPGA reduces system complexity.

With a surface-mount FCBGA package and a defined core voltage window, this part supports compact board integration and predictable power design. RoHS compliance and an industrial operating range make it a practical choice for industrial and infrastructure projects requiring reliable, long-term deployment.

Request a quote or submit an inquiry to get pricing, availability, and technical procurement information for the 5SGXEA7N2F40I3LN.

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