5SGXEA7N2F40I3LN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 467 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXEA7N2F40I3LN – Stratix® V GX FPGA, 622,000 Logic Elements, 600 I/Os
The 5SGXEA7N2F40I3LN is a Stratix V GX family Field Programmable Gate Array (FPGA) optimized for industrial applications that require large programmable logic capacity and extensive I/O. This device integrates 622,000 logic elements and approximately 51.2 Mbits of embedded memory, making it suitable for complex digital processing, high-channel I/O aggregation, and large-system integration.
Packaged in a 1517-BBGA FCBGA form and designed for surface-mount assembly, the device operates over an industrial temperature range and supports a low-voltage core supply, enabling dense, reliable designs in industrial environments.
Key Features
- Core Logic 622,000 logic elements provide substantial programmable fabric for large-scale digital designs and complex algorithm implementation.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and on-chip data structures to support high-throughput processing.
- I/O Density & Packaging 600 general-purpose I/Os delivered from a 1517-BBGA (FCBGA) package; supplier package listed as 1517-FBGA (40×40), suitable for high-pin-count board designs.
- Power Specified voltage supply range of 820 mV to 880 mV for the core, enabling predictable power budgeting for system designs.
- Thermal & Operating Range Industrial operating temperature range from −40 °C to 100 °C for deployment in industrial environments.
- Mounting & Form Factor Surface-mount package simplifies PCB assembly and supports compact multichip board layouts.
- Regulatory RoHS compliant.
Typical Applications
- Industrial Control Systems Large programmable fabric and extended temperature range support complex control algorithms, deterministic I/O handling, and on-site processing in industrial equipment.
- Communications & Networking High logic capacity and extensive I/O count enable protocol processing, packet handling, and interface aggregation in networking and communications infrastructure.
- Data Processing & Acceleration Substantial embedded memory and logic resources allow for offloading compute-intensive kernels and implementing custom accelerators for data-center or edge compute tasks.
- Imaging & Video Systems Large on-chip RAM and logic resources support multi-channel video processing, image conditioning, and real-time data handling pipelines.
Unique Advantages
- High Logic Density: 622,000 logic elements reduce the need for multiple FPGAs by consolidating complex functions into a single device.
- Significant On-Chip Memory: Approximately 51.2 Mbits of embedded RAM enable efficient buffering and low-latency data paths without external memory for many use cases.
- Extensive I/O Count: 600 I/Os facilitate direct interfacing to numerous peripherals, sensors, and high-channel-count systems.
- Industrial Temperature Rating: −40 °C to 100 °C operation allows deployment in harsh or temperature-variable environments.
- Compact, High-Pin Package: 1517-BBGA (FCBGA) package with a 1517-FBGA (40×40) supplier footprint supports high-density board designs while maintaining manageable form factor.
- Low-Voltage Core: Core supply range of 820–880 mV helps designers plan power delivery and thermal management precisely.
Why Choose 5SGXEA7N2F40I3LN?
The 5SGXEA7N2F40I3LN delivers a large programmable fabric and substantial embedded memory in an industrial-grade Stratix V GX device. Its combination of 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 600 I/Os makes it well suited for demanding digital signal processing, high-channel I/O aggregation, and complex control applications where a single, high-density FPGA reduces system complexity.
With a surface-mount FCBGA package and a defined core voltage window, this part supports compact board integration and predictable power design. RoHS compliance and an industrial operating range make it a practical choice for industrial and infrastructure projects requiring reliable, long-term deployment.
Request a quote or submit an inquiry to get pricing, availability, and technical procurement information for the 5SGXEA7N2F40I3LN.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018