5SGXEA7N2F45C1N

The 5SGXEA7N2F45C1N is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel (Altera) supplied in a 1932‑BBGA FCBGA package. It delivers high logic density and large on‑chip memory for complex, programmable digital designs, with a substantial I/O count and commercial temperature grading.

Designed for systems that require significant programmable logic, extensive embedded RAM, and large I/O capability, this device balances integration and board‑level density in a 45×45mm FBGA footprint.

Key Features

• Core Logic — 622,000 logic elements providing extensive programmable fabric for high‑complexity designs.
• Logic Array Blocks — 234,720 logic array blocks (LABs) to organize and optimize implemented logic structures.
• On‑chip Memory — Approximately 51.2 Mbits of embedded memory for buffering, lookup tables, and on‑chip storage.
• I/O Capacity — 840 user I/O pins to support high‑channel‑count interfaces and dense board connectivity.
• Power Supply — Core voltage range from 870 mV to 930 mV for defined operating conditions.
• Package & Mounting — 1932‑BBGA (FCBGA) package, supplier package 1932‑FBGA, FC (45×45); surface mount for compact system integration.
• Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• High‑density digital processing — Use the large logic element count and embedded memory to implement complex algorithms and signal processing pipelines on a single device.
• High‑pin‑count interface hubs — Leverage 840 I/Os for systems requiring many parallel or multiplexed connections and board‑level consolidation.
• Platform and prototype development — Ideal for validating dense logic architectures and memory‑rich designs in a commercial temperature environment.

Unique Advantages

• Substantial programmable capacity: 622,000 logic elements and 234,720 logic array blocks enable large, integrated designs without excessive device count.
• Significant on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces the need for external memory for many buffering and data‑path tasks.
• High I/O density: 840 user I/Os support multi‑channel systems and complex board interconnects, simplifying system partitioning.
• Compact FCBGA package: 1932‑BBGA (45×45mm) delivers high integration in a surface‑mount form factor for space‑constrained designs.
• Defined operating window: Commercial grade operation from 0 °C to 85 °C with a specified core voltage range (870–930 mV) for predictable system design.
• Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXEA7N2F45C1N?

This Stratix V GX device combines a large programmable fabric, substantial embedded memory, and extensive I/O to address complex digital designs where integration and I/O density matter. Its 1932‑BBGA FCBGA package and surface‑mount mounting make it suitable for compact, board‑level implementations within commercial temperature ranges.

Engineers and system designers targeting high‑capacity, memory‑intensive programmable solutions will find the 5SGXEA7N2F45C1N a compelling option for consolidating functionality, reducing external components, and maintaining predictable electrical and thermal parameters defined by the device specifications.

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