5SGXEA7N2F45C2L

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 51200000 622000 1932-BBGA, FCBGA

Quantity 439 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7N2F45C2L – Stratix® V GX FPGA, 622,000 logic elements, ~51 Mbits RAM, 840 I/Os

The 5SGXEA7N2F45C2L is a Stratix V GX Field Programmable Gate Array (FPGA) IC designed for high-density, high-I/O commercial applications. It combines a large logic fabric with substantial on-chip memory and a wide I/O count to support complex programmable logic implementations.

Specifications provided for this device indicate it is targeted at designs that require extensive programmable logic, significant embedded memory, and a large number of I/O pins, delivered in a surface-mount 1932-BBGA FCBGA package.

Key Features

  • Logic Capacity — 622,000 logic elements (logic cells) to implement complex digital functions and large-scale programmable logic designs.
  • Embedded Memory — Approximately 51 Mbits of on-chip RAM (51,200,000 bits) to store buffers, FIFOs, and intermediate data close to logic.
  • I/O Density — 840 user I/O pins to support wide parallel interfaces, multiple peripherals, and high-connectivity system designs.
  • Power Supply — Core voltage range specified at 820 mV to 880 mV, enabling designs that follow the device’s required supply envelope.
  • Package & Mounting — Surface-mount 1932-BBGA, FCBGA package; supplier device package listed as 1932-FBGA, FC (45×45) for board-level integration.
  • Commercial Grade Temperature — Operates from 0 °C to 85 °C, aligned with commercial-temperature applications.
  • Environmental Compliance — RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

  • High-density digital designs — Use the large logic element count to implement complex state machines, accelerators, and custom datapaths.
  • Memory-intensive embedded systems — Leverage approximately 51 Mbits of embedded RAM for buffering, packet queuing, and internal data storage.
  • High I/O systems — Deploy the 840 I/Os for multi-channel interfaces, parallel buses, and extensive peripheral connectivity.

Unique Advantages

  • Substantial logic capacity: 622,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing external components.
  • Significant embedded memory: Approximately 51 Mbits of on-chip RAM reduces the need for external memory for many buffering and queuing tasks.
  • Wide I/O availability: 840 I/Os facilitate designs that require many parallel interfaces or mixed-signal front-ends.
  • Compact, surface-mount package: The 1932-BBGA FCBGA format allows high-density PCB implementations while providing the pin-count required by large designs.
  • Commercial operating range: Specified 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.
  • Controlled core supply: Defined supply range of 820–880 mV supports predictable power design and board-level power budgeting.

Why Choose 5SGXEA7N2F45C2L?

The 5SGXEA7N2F45C2L offers a balanced combination of logic density, embedded memory, and I/O resources in a commercial-grade Stratix V GX FPGA package. Its specification set—622,000 logic elements, approximately 51 Mbits of on-chip RAM, 840 I/Os, and a 1932-BBGA FCBGA package—makes it suitable for designs that consolidate multiple functions into a single programmable device while maintaining a predictable thermal and power envelope.

This device is appropriate for engineering teams and procurement focused on high-density programmable solutions for commercial applications that require substantial on-chip resources and a large pin count. The defined operating temperature and RoHS compliance support common commercial manufacturing and deployment requirements.

Request a quote or submit a request for pricing and availability to begin evaluating the 5SGXEA7N2F45C2L for your next design.

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