5SGXEA7N2F45C2L
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 51200000 622000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 439 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXEA7N2F45C2L – Stratix® V GX FPGA, 622,000 logic elements, ~51 Mbits RAM, 840 I/Os
The 5SGXEA7N2F45C2L is a Stratix V GX Field Programmable Gate Array (FPGA) IC designed for high-density, high-I/O commercial applications. It combines a large logic fabric with substantial on-chip memory and a wide I/O count to support complex programmable logic implementations.
Specifications provided for this device indicate it is targeted at designs that require extensive programmable logic, significant embedded memory, and a large number of I/O pins, delivered in a surface-mount 1932-BBGA FCBGA package.
Key Features
- Logic Capacity — 622,000 logic elements (logic cells) to implement complex digital functions and large-scale programmable logic designs.
- Embedded Memory — Approximately 51 Mbits of on-chip RAM (51,200,000 bits) to store buffers, FIFOs, and intermediate data close to logic.
- I/O Density — 840 user I/O pins to support wide parallel interfaces, multiple peripherals, and high-connectivity system designs.
- Power Supply — Core voltage range specified at 820 mV to 880 mV, enabling designs that follow the device’s required supply envelope.
- Package & Mounting — Surface-mount 1932-BBGA, FCBGA package; supplier device package listed as 1932-FBGA, FC (45×45) for board-level integration.
- Commercial Grade Temperature — Operates from 0 °C to 85 °C, aligned with commercial-temperature applications.
- Environmental Compliance — RoHS compliant, supporting regulatory requirements for lead-free assembly.
Typical Applications
- High-density digital designs — Use the large logic element count to implement complex state machines, accelerators, and custom datapaths.
- Memory-intensive embedded systems — Leverage approximately 51 Mbits of embedded RAM for buffering, packet queuing, and internal data storage.
- High I/O systems — Deploy the 840 I/Os for multi-channel interfaces, parallel buses, and extensive peripheral connectivity.
Unique Advantages
- Substantial logic capacity: 622,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing external components.
- Significant embedded memory: Approximately 51 Mbits of on-chip RAM reduces the need for external memory for many buffering and queuing tasks.
- Wide I/O availability: 840 I/Os facilitate designs that require many parallel interfaces or mixed-signal front-ends.
- Compact, surface-mount package: The 1932-BBGA FCBGA format allows high-density PCB implementations while providing the pin-count required by large designs.
- Commercial operating range: Specified 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.
- Controlled core supply: Defined supply range of 820–880 mV supports predictable power design and board-level power budgeting.
Why Choose 5SGXEA7N2F45C2L?
The 5SGXEA7N2F45C2L offers a balanced combination of logic density, embedded memory, and I/O resources in a commercial-grade Stratix V GX FPGA package. Its specification set—622,000 logic elements, approximately 51 Mbits of on-chip RAM, 840 I/Os, and a 1932-BBGA FCBGA package—makes it suitable for designs that consolidate multiple functions into a single programmable device while maintaining a predictable thermal and power envelope.
This device is appropriate for engineering teams and procurement focused on high-density programmable solutions for commercial applications that require substantial on-chip resources and a large pin count. The defined operating temperature and RoHS compliance support common commercial manufacturing and deployment requirements.
Request a quote or submit a request for pricing and availability to begin evaluating the 5SGXEA7N2F45C2L for your next design.

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