5SGXEA7N2F45C2LG

The 5SGXEA7N2F45C2LG is a Stratix® V GX family FPGA device delivering large-scale programmable logic and on-chip memory in a high-count BGA package. It integrates extensive logic resources and embedded RAM with a transceiver-capable Stratix V GX architecture to address complex, high-density digital designs.

As a commercial-grade, surface-mount FCBGA device, this part is suited for systems that require substantial logic capacity, abundant embedded memory, and a high number of I/O pins while operating within a standard commercial temperature range.

Key Features

• Logic Capacity  Approximately 622,000 logic elements (cells) for implementing large, multi-function digital designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive algorithms.
• I/O Density  840 user I/Os to support wide bus interfaces, parallel data paths, and multi-protocol connectivity.
• Power Supply  Core voltage supply range of 820 mV to 880 mV for device core operation.
• Package & Mounting  1932-BBGA (FCBGA) package; supplier device package 1932-FBGA, FC (45×45). Surface-mount mounting type.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Implement large-scale logic functions and custom compute pipelines that require hundreds of thousands of logic elements.
• Memory-intensive algorithms  Use the device’s ~51.2 Mbits of embedded RAM for buffering, packet queues, and LUT-based processing.
• I/O-heavy systems  Deploy in applications that need large parallel interfaces or numerous discrete signals using the 840 I/Os.
• Platform integration  Integrate into commercial embedded systems where a high-capacity FPGA in a 1932-BBGA FCBGA package is required.

Unique Advantages

• High logic density: The device’s ~622k logic elements enable consolidation of multiple functions into a single FPGA, reducing system complexity.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM supports larger buffers and state storage without external memory.
• Extensive I/O availability: 840 I/Os provide design flexibility for wide interfaces, multiple peripherals, and parallel data channels.
• Compact, high-pin-count package: 1932-BBGA (45×45) package offers a high interconnect density suitable for complex board-level integrations.
• Commercial temperature rating: Designed for 0 °C to 85 °C operation to match standard commercial embedded deployments.
• RoHS compliance: Meets environmental regulatory requirements for lead-free assembly.

Why Choose 5SGXEA7N2F45C2LG?

This Stratix® V GX FPGA combines large logic capacity, significant on-chip memory, and a high I/O count within a 1932-BBGA FCBGA surface-mount package, positioning it for demanding commercial embedded designs that require integrated, high-density programmable logic. Its commercial temperature rating and RoHS compliance support standard production and environmental requirements.

Designers and system integrators targeting complex logic integration, memory-heavy functions, and broad I/O connectivity will find the 5SGXEA7N2F45C2LG appropriate for consolidating functions and simplifying board-level architecture while leveraging the Stratix V GX device family characteristics.

Request a quote or submit a pricing and availability inquiry to get lead-time and ordering details for the 5SGXEA7N2F45C2LG FPGA. Provide part number and quantity for a prompt response.