5SGXEA7N2F45C2G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 51200000 622000 1932-BBGA, FCBGA

Quantity 1,683 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7N2F45C2G – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXEA7N2F45C2G is a Stratix V GX family FPGA offering a high-density programmable logic fabric with integrated on-chip memory and extensive I/O. It targets designs that require large logic capacity, substantial embedded RAM, and a broad I/O count in a surface-mount FCBGA footprint.

Key on-device metrics include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 840 I/Os. The device is supplied for commercial-grade applications and operates within a 0 °C to 85 °C temperature range with a core supply range of 870 mV to 930 mV.

Key Features

  • Core Architecture — Stratix V GX: Part of the Stratix V GX family, which the datasheet describes with transceiver speed-grade options for the family.
  • Logic Capacity: 622,000 logic elements to support complex programmable logic implementations and large-scale designs.
  • Embedded Memory: Approximately 51.2 Mbits of on-chip RAM for local buffering, state storage, and memory-intensive logic functions.
  • I/O Count: 840 I/Os to accommodate wide parallel interfaces and dense board-level connectivity.
  • Power and Supply: Core voltage supply range of 870 mV to 930 mV, enabling defined power design and sequencing for the FPGA core.
  • Package and Mounting: Surface-mount 1932-BBGA / FCBGA package (supplier package: 1932-FBGA, FC, 45×45), suitable for compact board designs.
  • Commercial Temperature Grade: Rated for operation from 0 °C to 85 °C, aligned with commercial application environments.
  • Standards Compliance: RoHS compliant, meeting common lead-free and environmental requirements.

Typical Applications

  • Transceiver and Serial Interface Systems: Use the Stratix V GX family transceiver capabilities (as defined for the family in the datasheet) alongside the device’s high I/O count to implement high-speed serial interface functions.
  • High-Density Logic Integration: Employ the 622,000 logic elements to consolidate complex glue logic, protocol handling, or large combinational/sequential logic blocks into a single device.
  • On-Chip Memory-Intensive Functions: Leverage approximately 51.2 Mbits of embedded RAM for local buffering, packet processing, or stateful data handling without external memory dependence.

Unique Advantages

  • Substantial Logic Resources: 622,000 logic elements simplify partitioning and reduce the need for multiple FPGAs in dense digital designs.
  • Large Embedded RAM: Approximately 51.2 Mbits of on-chip memory reduces external memory requirements and supports latency-sensitive buffering and data processing.
  • Extensive I/O: 840 available I/Os provide flexibility for parallel buses, multi-lane interfaces, and board-level routing choices.
  • Compact FCBGA Package: The 1932-BBGA / 1932-FBGA (45×45) footprint enables high pin density in a surface-mount form factor suitable for space-constrained assemblies.
  • Commercial Temperature Rating: Designed for 0 °C to 85 °C operation, matching typical commercial electronics deployment conditions.
  • Regulatory Compliance: RoHS compliance supports adherence to common environmental and manufacturing requirements.

Why Choose 5SGXEA7N2F45C2G?

The 5SGXEA7N2F45C2G provides designers a highly integrated Stratix V GX-class FPGA that combines large programmable logic capacity, substantial embedded RAM, and a high I/O count in a compact FCBGA package. Its commercial temperature rating and defined core supply range make it suitable for a wide range of commercial electronic systems where density and on-chip memory are priorities.

This device is well suited for engineering teams building complex, memory- and I/O-intensive FPGA systems that benefit from consolidating functions onto a single high-density device while maintaining compliance with RoHS requirements and established commercial operating ranges.

Request a quote or submit your specifications to receive pricing and availability for the 5SGXEA7N2F45C2G. Our team can provide component availability and configuration details to support your design cycle.

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