5SGXEA7N2F45C1G

The 5SGXEA7N2F45C1G is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, provided in a 1932-ball FCBGA package for surface-mount assembly. It delivers very large programmable logic capacity and embedded memory with a broad set of I/O resources in a commercial-grade device.

Designed for designs that require high logic density, substantial on-chip RAM and extensive I/O, this device combines 622,000 logic elements with approximately 51.2 Mbits of embedded memory and up to 840 I/O pins while operating within a core voltage range of 870 mV to 930 mV and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic 622,000 logic elements provide large-scale programmable logic capacity for complex digital designs and high-density implementations.
• Embedded Memory Approximately 51.2 Mbits of on-chip RAM for buffering, data storage, and high-throughput algorithm implementation.
• I/O Capacity Up to 840 user I/O pins to accommodate wide parallel interfaces, large bus structures, and multiple peripheral connections.
• Power and Supply Core supply range of 870 mV to 930 mV to match system power rails and enable predictable core performance within specified limits.
• Package and Mounting 1932-ball BGA (FCBGA, supplier package 1932-FBGA, FC 45×45) in a surface-mount form factor for compact board-level integration.
• Commercial Grade Operation Rated for commercial temperature operation from 0 °C to 85 °C.
• RoHS Compliance Device is RoHS compliant for global electronics manufacturing requirements.

Typical Applications

• High-density digital processing — Leverage 622,000 logic elements and extensive embedded RAM for large-scale FPGA-implemented algorithms and custom accelerators.
• Multi-channel I/O systems — Use up to 840 I/Os to interface with wide parallel buses, multi-lane data paths, or numerous peripherals.
• Memory-intensive designs — Approximately 51.2 Mbits of on-chip RAM supports buffering, packet processing, or storage for real-time data flows.

Unique Advantages

• High logic density: 622,000 logic elements enable consolidation of complex functions into a single FPGA, reducing board-level integration complexity.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM minimizes external memory dependence for many data-path and buffering needs.
• Extensive I/O resources: 840 I/Os provide flexibility for diverse interface requirements and parallel connectivity without immediate need for I/O expanders.
• Compact package: 1932-ball FCBGA in a 45×45 outline supports high integration density in space-constrained PCB designs.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C for standard commercial deployments.

Why Choose 5SGXEA7N2F45C1G?

The 5SGXEA7N2F45C1G combines very large programmable logic resources, significant on-chip RAM, and broad I/O capability in a compact FCBGA package, making it suited to high-density, memory-intensive, and I/O-rich FPGA applications that operate within commercial temperature ranges. As a Stratix® V GX device from Intel, it aligns with system designs that demand consolidated logic and memory on a single programmable device while retaining predictable electrical and thermal operating ranges.

This part is appropriate for engineering teams and procurement focused on high-capacity FPGA implementations where integration density, embedded memory, and extensive I/O are primary selection criteria.

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