5SGXEA7N2F40I3G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 600 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXEA7N2F40I3G – Stratix® V GX FPGA, 622k logic elements
The 5SGXEA7N2F40I3G is a Stratix V GX Field Programmable Gate Array (FPGA) in a 1517-BBGA FCBGA package designed for high-density, industrial-grade programmable logic applications. Built around the Stratix V GX family architecture, this device combines a large logic fabric, substantial on-chip memory, and a high I/O count to address complex digital designs where integration and robustness are required.
Key attributes include approximately 622,000 logic elements, approximately 51.2 Mbits of embedded memory, 600 I/Os, RoHS compliance, and an industrial operating temperature range. The device is supplied in a surface-mount 1517-FBGA (40×40) package with specified core voltage supply limits.
Key Features
- Core and Logic Approximately 622,000 logic elements with 234,720 logic blocks reported in device data, supporting dense logic implementation and complex design mapping.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM, providing sizeable local storage for buffers, state machines, and embedded processing tasks.
- I/O Density 600 user I/Os to support wide parallel interfaces and multi-channel connectivity in high-pin-count designs.
- Package and Mounting 1517-BBGA (FCBGA) package, supplier device package noted as 1517-FBGA (40×40); surface-mount mounting type for compact, high-density board designs.
- Powering Specified core voltage supply range of 820 mV to 880 mV, enabling integration with regulated low-voltage power domains.
- Temperature and Grade Industrial grade with an operating temperature range of −40°C to 100°C for extended-temperature deployments.
- Regulatory RoHS compliant, supporting lead-free manufacturing requirements.
Unique Advantages
- High integration density: The combination of ~622k logic elements and ~51.2 Mbits of embedded memory reduces external component needs for complex logic and buffering.
- Extensive I/O capability: 600 I/Os enable wide parallel data paths and multiple interface endpoints without heavy board-level multiplexing.
- Industrial reliability: Rated for −40°C to 100°C operation and specified as industrial grade for use in temperature-challenging environments.
- Compact, high-pin-count package: 1517-FBGA (40×40) surface-mount package supports high pin density in a compact footprint for space-constrained systems.
- Controlled core voltage window: Defined supply range (820–880 mV) simplifies power-supply planning and voltage-rail design on the PCB.
- Standards-compliant manufacturing: RoHS compliance supports lead-free production workflows.
Why Choose 5SGXEA7N2F40I3G?
As a Stratix V GX family FPGA, the 5SGXEA7N2F40I3G offers a high-density programmable fabric, substantial embedded memory, and a large I/O complement in an industrial-grade, surface-mount package. These characteristics make it well suited for designs that require integration of complex digital logic, significant on-chip buffering, and high pin-count interfaces while operating across an extended temperature range.
The device benefits from documented Stratix V electrical and switching characteristics and is provided in a 1517-FBGA package to support high-performance board implementations where space and pin density matter. Its specified voltage and thermal ranges assist in predictable system-level power and thermal design.
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