5SGXEA7N2F40I2WN

The 5SGXEA7N2F40I2WN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC manufactured by Intel. It integrates a high density of programmable logic, embedded RAM, and extensive I/O resources in a 1517-BBGA FCBGA package, delivering a platform for designs that require large-scale logic, embedded memory, and transceiver-capable device characteristics as described in the Stratix V device datasheet.

With an industrial temperature grade and a low-voltage core supply range, this device is intended for applications that need substantial on-chip resources and reliable operation across a wide temperature range.

Key Features

• Core Logic 
  Provides 622,000 logic elements (logic element cells) for high-density programmable logic implementation.
• Embedded Memory 
  Includes approximately 51.2 Mbits of on-chip RAM for buffering, packet processing, and large local storage needs.
• I/O Resources 
  Equipped with 600 I/O pins to support broad peripheral and system interfacing requirements.
• Package and Mounting 
  Supplied in a 1517-BBGA (1517-FBGA, 40×40) FCBGA package with surface-mount mounting for compact system integration.
• Power 
  Core voltage supply range: 870 mV to 930 mV, enabling use in designs targeting low-voltage core operation.
• Temperature and Grade 
  Industrial grade device rated for operation from −40 °C to 100 °C for extended temperature environments.
• Compliance 
  RoHS compliant to support regulatory and assembly requirements.

Typical Applications

• High‑speed communications 
  Leverages Stratix V GX device characteristics to implement high-density protocol logic and transceiver-enabled interfaces as documented in the device family datasheet.
• Data processing and acceleration 
  Uses on-chip RAM and large logic resources for packet processing, signal processing, and hardware-accelerated algorithms.
• Prototyping and system integration 
  Provides a high-density programmable platform for validating complex RTL, integrating large I/O counts, and consolidating multiple functions on a single device.

Unique Advantages

• High logic density: 622,000 logic elements enable consolidation of large designs and complex state machines on a single device.
• Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces dependence on external memory for many buffering and processing tasks.
• Extensive I/O capability: 600 I/Os support diverse interfaces and multi-channel system connectivity without immediate need for external multiplexing.
• Industrial temperature range: Rated from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compact, robust packaging: 1517-BBGA FCBGA (1517-FBGA, 40×40) surface-mount package facilitates high-density board layouts.
• Low-voltage core operation: Core supply range of 870–930 mV supports low-voltage system designs.

Why Choose 5SGXEA7N2F40I2WN?

The 5SGXEA7N2F40I2WN places a very large programmable fabric, significant embedded memory, and a high I/O count into a single industrial‑grade Stratix V GX package. It is well suited to engineers and procurement teams seeking a high‑capacity FPGA platform that supports complex logic, substantial local memory, and extensive connectivity while operating over a wide temperature range.

For projects that require scalability and consolidated system functionality, this device offers a balance of density, embedded resources, and package options consistent with Stratix V family specifications and design practices.

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