5SGXEA7N2F40I2L

The 5SGXEA7N2F40I2L is an Intel Stratix® V GX field programmable gate array (FPGA) packaged in a 1517‑BBGA (FCBGA) footprint. It provides high logic density and a large I/O count for complex programmable-logic designs that require significant on‑chip memory and I/O resources.

With 622,000 logic elements and approximately 51.2 Mbits of embedded memory, this industrial‑grade device targets designs that need substantial programmable logic, high channel counts, and operation across an extended temperature range.

Key Features

• Core Logic Density — 622,000 logic elements to implement large, complex designs and custom processing functions.
• Embedded Memory — Approximately 51.2 Mbits of on‑chip RAM for buffering, FIFOs, and on‑die data storage.
• I/O Capacity — 600 user I/O pins to support high channel counts and extensive interfacing.
• Logic Array Blocks — 234,720 logic array blocks (LABs) for structured logic implementation.
• Power Supply — Core voltage supply range 820 mV to 880 mV for device operation.
• Package & Mounting — 1517‑BBGA, FCBGA (supplier device package: 1517‑FBGA 40×40); surface mount package suitable for board‑level integration.
• Temperature Range — Industrial operating range from −40 °C to 100 °C for deployment in environments requiring extended temperature tolerance.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High‑density programmable logic systems — Implement large FPGA designs that require extensive logic capacity and embedded memory.
• Multi‑channel I/O platforms — Support systems needing hundreds of I/O signals for interface aggregation or cross‑bar switching.
• Industrial equipment — Use in industrial applications that require operation across −40 °C to 100 °C and industrial grading.

Unique Advantages

• Substantial logic resources — 622,000 logic elements reduce the need to partition designs across multiple devices.
• Large on‑chip RAM — Approximately 51.2 Mbits of embedded memory enables sizable buffering and data processing on‑die.
• Extensive I/O — 600 I/Os provide flexibility for high‑channel interconnect and complex system interfaces.
• Industrial temperature rating — Specified −40 °C to 100 °C for applications that require extended environmental tolerance.
• Standard surface‑mount FCBGA package — 1517‑BBGA packaging facilitates integration into high‑density PCB layouts.
• RoHS compliant — Meets common environmental requirements for electronics manufacturing.

Why Choose 5SGXEA7N2F40I2L?

The 5SGXEA7N2F40I2L positions itself as a high‑capacity Stratix V GX FPGA designed for projects that demand large programmable logic resources, significant embedded memory, and a high number of I/Os within an industrial temperature envelope. Its combination of 622,000 logic elements, approximately 51.2 Mbits of on‑chip RAM, and 600 I/Os provides the integration density required for complex data‑path, control, and interface functions.

This device is suited to teams and designs prioritizing scalability and robustness in challenging environments, and it leverages the Stratix V GX family characteristics for designs that need both logic headroom and extensive I/O capability.

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