5SGXEA7N2F40C2N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 406 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXEA7N2F40C2N – Stratix® V GX FPGA, 600 I/O, 1517‑BBGA
The 5SGXEA7N2F40C2N is a Stratix V GX Field Programmable Gate Array (FPGA) in a 1517‑BBGA (FCBGA) package. It provides a high-density logic fabric and substantial on-chip memory for complex digital designs requiring large logic capacity and extensive I/O.
Designed as a commercial‑grade device, this FPGA targets applications that need significant embedded memory, many I/O pins, and a compact surface‑mount package while operating within standard commercial temperature and core voltage ranges.
Key Features
- Logic Capacity — 622,000 logic elements suitable for large-scale digital integration and complex logic designs.
- Embedded Memory — Approximately 51.2 Mbits of on‑chip RAM to support data buffering, FIFOs, and local storage for high‑throughput processing.
- I/O — 600 user I/O pins providing wide external connectivity for multi‑lane interfaces and dense board routing.
- Package & Mounting — 1517‑BBGA (FCBGA) package; supplier device package listed as 1517‑FBGA (40×40). Surface mount component for board‑level assembly.
- Power — Core supply range specified at 870 mV to 930 mV for core power planning and regulator selection.
- Temperature Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Compliance — RoHS compliant.
Typical Applications
- High‑density digital systems — Use the large logic capacity and abundant I/O to implement complex control, protocol handling, and parallel processing blocks.
- Memory‑intensive designs — Leverage approximately 51.2 Mbits of embedded RAM for buffering, real‑time data processing, and intermediate storage.
- Multi‑I/O interface platforms — 600 I/O pins support multi‑lane interfaces, dense peripheral connectivity, and board partitioning where high pin count is required.
Unique Advantages
- Substantial logic density — 622,000 logic elements enable consolidation of large designs into a single FPGA, reducing system complexity.
- Significant on‑chip memory — Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and scratchpad needs.
- High I/O count — 600 user I/O pins allow flexible interfacing and simplify routing for multiport or multi‑channel applications.
- Compact FCBGA package — 1517‑BBGA footprint provides a high pin density in a surface‑mount form factor suitable for space‑constrained designs.
- Clear commercial specification — Documented operating temperature and core voltage ranges support predictable system engineering and power budgeting.
Why Choose 5SGXEA7N2F40C2N?
This Stratix V GX FPGA delivers a combination of large logic element count, abundant embedded memory, and a high pin‑count package tailored for complex, memory‑heavy digital designs. Its commercial grade rating and defined operating ranges make it suitable for mainstream high‑performance applications where integration density and I/O capacity drive design choices.
Selecting 5SGXEA7N2F40C2N is a practical choice for teams building consolidated FPGA solutions that require significant on‑chip resources, a compact surface‑mount BGA package, and compliance with RoHS requirements.
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