5SGXEB5R1F43C2N

The 5SGXEB5R1F43C2N is a Stratix V GX Field Programmable Gate Array (FPGA) IC designed for high-density digital designs. It delivers large on-chip resources with 490,000 logic elements and approximately 42 Mbits of embedded memory to support complex logic and memory-intensive functions.

Packaged in a 1760-FCBGA (42.5 × 42.5 mm) surface-mount package, the device provides 600 I/Os and operates from a core supply of 870 mV to 930 mV. It is offered in a commercial temperature grade with an operating range of 0 °C to 85 °C and is RoHS compliant.

Key Features

• Core / Logic Capacity  490,000 logic elements for implementing large-scale designs and complex logic functions.
• Embedded Memory  Approximately 42 Mbits of on-chip RAM to support data buffering, state storage, and memory-intensive processing tasks.
• I/O Density  600 I/Os to support extensive peripheral interfacing, multi-channel connectivity, and board-level integration.
• Package & Mounting  1760-BBGA / 1760-FCBGA package; supplier device package listed as 1760-FCBGA (42.5 × 42.5 mm). Surface-mount mounting type for standard PCB assembly flows.
• Power Supply  Core voltage supply range of 870 mV to 930 mV for core power planning and regulator selection.
• Temperature & Grade  Commercial grade operation with specified operating temperature of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital processing  Use the large logic fabric and embedded memory to implement custom accelerators, DSP pipelines, and complex state machines.
• Complex I/O systems  600 I/Os enable multi-channel data aggregation, protocol bridging, and extensive sensor or peripheral interfacing on a single FPGA.
• Networking and communications equipment  High logic and I/O resources fit board-level designs that require extensive packet processing, control logic, or interface management in commercial environments.

Unique Advantages

• High integration density: 490,000 logic elements reduce the need for multiple discrete logic devices and simplify system architecture.
• Substantial embedded memory: Approximately 42 Mbits of on-chip RAM supports buffering and memory-centric functions without relying solely on external memory.
• Extensive interfacing capability: 600 I/Os provide flexibility for complex systems with many peripherals, channels, or board-level interfaces.
• Compact surface-mount FCBGA: 1760-FCBGA (42.5 × 42.5 mm) package supports dense PCB layouts and streamlined assembly processes.
• Commercial temperature grade: Rated 0 °C to 85 °C for standard commercial deployments.
• RoHS compliant: Meets common regulatory requirements for lead-free assembly.

Why Choose 5SGXEB5R1F43C2N?

The 5SGXEB5R1F43C2N provides a combination of large logic capacity, substantial embedded memory, and high I/O count in a single, surface-mount FCBGA package—making it well suited for commercial designs that demand significant on-chip resources and flexible interfacing. Its defined core voltage range and commercial temperature rating simplify power and thermal planning for production systems.

As a Stratix V GX family device, it is positioned for customers building complex FPGA-based solutions that require scalable logic and memory resources along with a high degree of board-level integration.

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