5SGXEB5R1F43I2G

IC FPGA 600 I/O 1760FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 41984000 490000 1760-BBGA, FCBGA

Quantity 143 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits41984000

Overview of 5SGXEB5R1F43I2G – Stratix® V GX FPGA IC, 1760-FCBGA

The 5SGXEB5R1F43I2G is a Stratix® V GX field-programmable gate array (FPGA) in a 1760-FCBGA package, designed for high-density, industrial-grade programmable logic applications. It combines a large logic capacity and substantial on-chip RAM with a high I/O count and low-voltage core operation to support complex system integration in industrial environments.

Key Features

  • Core Logic  Approximately 490,000 logic elements, enabling large-scale custom digital designs and complex logic implementations.
  • Embedded Memory  Approximately 42 Mbits of on-chip RAM (41,984,000 bits) for buffering, tables, and storage close to logic to reduce external memory dependencies.
  • I/O Integration  Up to 600 user I/O pins to support multi-channel interfaces and extensive peripheral connectivity.
  • Power and Voltage  Core voltage supply range of 870 mV to 930 mV for the FPGA core domain.
  • Package and Mounting  1760‑FBGA (1760‑FCBGA, 42.5 × 42.5 mm) package; surface-mount construction suitable for high-density board layouts.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for use in industrial temperature environments.
  • Standards Compliance  RoHS-compliant construction for environmental and supply-chain conformity.

Typical Applications

  • Industrial Control and Automation  Large logic capacity and industrial temperature rating enable complex control algorithms and robust operation on the factory floor.
  • High-Density I/O Systems  The 600 I/O pins support multi-channel sensor interfaces, data aggregation, and extensive peripheral connectivity.
  • Network and Communication Infrastructure  Substantial embedded RAM and logic resources support packet processing, protocol handling, and hardware acceleration tasks.
  • System Integration and Prototyping  High logic and memory resources combined in a single FCBGA package allow consolidation of functions that reduce board-level complexity.

Unique Advantages

  • High logic density: Approximately 490,000 logic elements provide headroom for complex, multi-domain FPGA designs without immediate external hardware expansion.
  • Significant on-chip memory: Approximately 42 Mbits of embedded RAM reduce dependency on external memory for many buffering and storage tasks.
  • Extensive I/O capability: 600 I/O pins make the device suitable for designs requiring broad peripheral connectivity or multi-channel data paths.
  • Industrial operating range: −40 °C to 100 °C rating supports deployment in temperature-demanding industrial applications.
  • Compact, high-pin-count package: 1760-FCBGA (42.5 × 42.5 mm) delivers high integration density for space-constrained PCBs.
  • Low-voltage core operation: 870–930 mV core supply supports designs targeting optimized core-power domains.

Why Choose 5SGXEB5R1F43I2G?

The 5SGXEB5R1F43I2G delivers a combination of high logic capacity, substantial embedded memory, and a large I/O count in an industrial-temperature, RoHS-compliant FCBGA package. It is suited to engineers and system designers who need a high-density, configurable logic platform for industrial control, communications infrastructure, and complex system integration.

Backed by the Stratix V family documentation, this part provides a stable platform for designs that require scalable logic resources, significant on-chip RAM, and robust operation across demanding temperature ranges.

Request a quote or submit an RFQ to receive pricing and availability for the 5SGXEB5R1F43I2G.

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