5SGXEB5R2F40C1N

The 5SGXEB5R2F40C1N is an Intel Stratix® V GX FPGA in a 1517‑FBGA (40×40) package, offered as a commercial‑grade, surface‑mount device. It combines high logic capacity, substantial on‑chip RAM, and a large I/O complement for complex digital designs.

This device targets designs that require dense programmable logic, significant embedded memory, and extensive I/O connectivity while operating within a commercial temperature range and a core supply window of 870 mV to 930 mV.

Key Features

• Logic Capacity  Approximately 490,000 logic elements to implement large finite‑state machines, datapaths, and custom processing pipelines.
• Embedded Memory  Approximately 42 Mbits of on‑chip RAM for buffering, look‑up tables, and high‑throughput data storage.
• I/O Density  432 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package & Mounting  1517‑FBGA (40×40) package in a surface‑mount form factor suitable for high‑density PCB designs.
• Power and Supply  Core voltage supply range of 870 mV to 930 mV for compatible power‑domain planning.
• Temperature & Grade  Commercial grade operation from 0 °C to 85 °C for standard commercial environments.
• I/O and Timing Features  Documented I/O timing characteristics including programmable I/O element delay and programmable output buffer delay, as described in the Stratix V device datasheet.
• Standards Compliance  RoHS compliant for environmental and regulatory alignment.

Typical Applications

• High‑density digital processing  Large logic element count and embedded memory make this device suitable for complex signal processing and custom compute functions.
• High‑pin‑count interface bridging  432 I/O pins support wide parallel buses, external memory interfaces, and multi‑protocol front ends.
• High‑bandwidth serial and I/O timing designs  Stratix V GX family transceiver and programmable I/O timing features (refer to the Stratix V datasheet) support designs requiring precise I/O timing and high‑speed link management.

Unique Advantages

• High logic integration: Approximately 490,000 logic elements reduce the need for multi‑device solutions and simplify board-level design.
• Large on‑chip memory: Approximately 42 Mbits of embedded RAM enables extensive buffering and on‑chip storage, improving throughput and latency for data‑intensive tasks.
• Wide I/O capability: 432 I/O pins permit flexible system partitioning and multiple external interfaces without additional bridging components.
• Commercial temperature rating: 0 °C to 85 °C operation matches standard commercial deployments and streamlines thermal design for many applications.
• Surface‑mount FBGA package: 1517‑FBGA (40×40) supports compact, high‑density PCB layouts and automated assembly processes.
• RoHS compliant: Meets lead‑free and restricted‑substance requirements for global product distribution.

Why Choose 5SGXEB5R2F40C1N?

The 5SGXEB5R2F40C1N Stratix V GX FPGA delivers a strong balance of logic density, embedded memory, and I/O capacity in a compact 1517‑FBGA package. Its documented I/O timing features and family transceiver capabilities (described in the Stratix V datasheet) support designs that demand precise interfacing and substantial on‑chip resources while operating within a commercial temperature range and standard core voltages.

This device is well suited for engineers and procurement teams building high‑complexity FPGA designs that require scalable logic resources, significant embedded RAM, and extensive external connectivity, backed by Intel’s Stratix V device documentation and compliance attributes.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the 5SGXEB5R2F40C1N.