5SGXMA5K1F40I2WN

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 46080000 490000 1517-BBGA, FCBGA

Quantity 187 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5K1F40I2WN – Stratix® V GX FPGA, 490,000 logic elements, 696 I/Os

The 5SGXMA5K1F40I2WN is a Stratix V GX field-programmable gate array (FPGA) IC from Intel, offered in an industrial temperature grade. It provides a high density of programmable logic and on‑chip memory suitable for complex, memory‑intensive FPGA designs.

Key attributes include approximately 490,000 logic elements, about 46.08 Mbits of embedded memory, and 696 user I/O pins, delivered in a 1517‑BBGA (FCBGA) package with surface‑mount mounting.

Key Features

  • Logic Capacity  Approximately 490,000 logic elements for implementing large-scale, high-density logic designs.
  • Embedded Memory  Approximately 46.08 Mbits of on-chip RAM to support memory‑intensive functions and buffering.
  • I/O and Packaging  696 user I/Os in a 1517‑BBGA (FCBGA) package; supplier device package listed as 1517‑FBGA (40×40). Surface mount package for compact board integration.
  • Power  Core supply range specified at 870 mV to 930 mV for the device core domain.
  • Thermal and Grade  Industrial temperature grade with an operating range of −40 °C to 100 °C.
  • Standards and Compliance  RoHS‑compliant design.

Unique Advantages

  • High logic density: Large logic element count enables implementation of complex FPGA architectures without external logic.
  • Significant on‑chip memory: Approximately 46.08 Mbits of embedded RAM reduces dependence on external memory for many data‑buffering and stateful functions.
  • Extensive I/O: 696 I/O pins support rich peripheral and interface connectivity within a single device footprint.
  • Industrial temperature rating: Rated for −40 °C to 100 °C operation to meet industrial application temperature demands.
  • Compact FCBGA package: 1517‑BBGA (1517‑FBGA 40×40) package supports high interconnect density while maintaining a surface‑mount form factor.
  • Regulatory compliance: RoHS compliant for environmental and regulatory alignment.

Why Choose 5SGXMA5K1F40I2WN?

The 5SGXMA5K1F40I2WN delivers a high level of integration—large logic capacity, substantial on‑chip RAM, and a high I/O count—packaged for industrial temperature operation. These attributes make it suitable for designers who need a single FPGA device to handle dense logic, significant buffering, and extensive interface requirements.

As a Stratix V GX family device from Intel, the part is documented in the Stratix V device datasheet that details electrical and switching characteristics relevant to system design and validation.

Request a quote or submit a product inquiry to obtain pricing, availability, and lead time information for the 5SGXMA5K1F40I2WN.

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