5SGXMA5K1F40I2WN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 46080000 490000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 187 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5K1F40I2WN – Stratix® V GX FPGA, 490,000 logic elements, 696 I/Os
The 5SGXMA5K1F40I2WN is a Stratix V GX field-programmable gate array (FPGA) IC from Intel, offered in an industrial temperature grade. It provides a high density of programmable logic and on‑chip memory suitable for complex, memory‑intensive FPGA designs.
Key attributes include approximately 490,000 logic elements, about 46.08 Mbits of embedded memory, and 696 user I/O pins, delivered in a 1517‑BBGA (FCBGA) package with surface‑mount mounting.
Key Features
- Logic Capacity Approximately 490,000 logic elements for implementing large-scale, high-density logic designs.
- Embedded Memory Approximately 46.08 Mbits of on-chip RAM to support memory‑intensive functions and buffering.
- I/O and Packaging 696 user I/Os in a 1517‑BBGA (FCBGA) package; supplier device package listed as 1517‑FBGA (40×40). Surface mount package for compact board integration.
- Power Core supply range specified at 870 mV to 930 mV for the device core domain.
- Thermal and Grade Industrial temperature grade with an operating range of −40 °C to 100 °C.
- Standards and Compliance RoHS‑compliant design.
Unique Advantages
- High logic density: Large logic element count enables implementation of complex FPGA architectures without external logic.
- Significant on‑chip memory: Approximately 46.08 Mbits of embedded RAM reduces dependence on external memory for many data‑buffering and stateful functions.
- Extensive I/O: 696 I/O pins support rich peripheral and interface connectivity within a single device footprint.
- Industrial temperature rating: Rated for −40 °C to 100 °C operation to meet industrial application temperature demands.
- Compact FCBGA package: 1517‑BBGA (1517‑FBGA 40×40) package supports high interconnect density while maintaining a surface‑mount form factor.
- Regulatory compliance: RoHS compliant for environmental and regulatory alignment.
Why Choose 5SGXMA5K1F40I2WN?
The 5SGXMA5K1F40I2WN delivers a high level of integration—large logic capacity, substantial on‑chip RAM, and a high I/O count—packaged for industrial temperature operation. These attributes make it suitable for designers who need a single FPGA device to handle dense logic, significant buffering, and extensive interface requirements.
As a Stratix V GX family device from Intel, the part is documented in the Stratix V device datasheet that details electrical and switching characteristics relevant to system design and validation.
Request a quote or submit a product inquiry to obtain pricing, availability, and lead time information for the 5SGXMA5K1F40I2WN.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018