5SGXMA5K2F35C1G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 46080000 490000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 605 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5K2F35C1G – Stratix® V GX FPGA IC, approximately 490,000 logic elements, 1152‑BBGA
The 5SGXMA5K2F35C1G is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, offering a high-density programmable fabric with on-chip memory and extensive I/O. This commercial-grade device provides a combination of large logic capacity, significant embedded RAM, and a high I/O count for complex digital designs.
Engineered for applications that require substantial programmable logic and on-chip storage, the device is supplied in a 1152‑BBGA (FCBGA) package and operates within a commercial temperature range and a nominal core supply window, enabling integration into demanding board-level systems.
Key Features
- Logic Capacity — Approximately 490,000 logic elements for implementing large-scale combinational and sequential logic functions.
- Embedded Memory — Approximately 46 Mbits of on-chip RAM (46,080,000 total RAM bits) to support packet buffering, FIFOs, and local data storage without external memory.
- I/O Resources — 432 general-purpose I/O pins to support wide parallel interfaces and multiple peripheral connections.
- Power Input Range — Core voltage supply range of 870 mV to 930 mV to match platform power-rail design requirements.
- Package and Mounting — 1152‑BBGA FCBGA package, supplier device package 1152‑FBGA (35×35), designed for surface-mount assembly on modern PCBs.
- Operating Grade and Temperature — Commercial grade with an operating temperature range of 0°C to 85°C suitable for standard commercial applications.
- Compliance — RoHS compliant for environmentally conscious designs and regulatory alignment.
Typical Applications
- High‑density digital processing — Use the large logic element count and embedded RAM to implement complex signal processing pipelines and algorithm acceleration.
- High‑pin-count interface hubs — Leverage 432 I/O pins to aggregate and bridge multiple parallel interfaces or route wide buses between sub-systems.
- Protocol and packet handling — On-chip RAM and programmable logic enable packet buffering, framing, and protocol state machines for networking and communications tasks.
Unique Advantages
- Substantial programmable capacity: Approximately 490,000 logic elements provide headroom for large designs and feature-rich implementations.
- Significant on‑chip memory: Approximately 46 Mbits of embedded RAM reduces reliance on external memory, lowering BOM complexity and board area.
- High I/O density: 432 I/Os allow flexible interfacing options and support for wide parallel connections without external multiplexing.
- Compact, assembly‑ready package: 1152‑BBGA (35×35) FCBGA format supports modern surface‑mount assembly and dense board layouts.
- Commercial operating range: Rated for 0°C to 85°C operation to match standard electronic product environments.
Why Choose 5SGXMA5K2F35C1G?
The 5SGXMA5K2F35C1G balances high logic density, substantial embedded memory, and abundant I/O in a single commercial-grade Stratix V GX FPGA package. These attributes make it well suited for engineers developing large-scale logic designs, packet-processing engines, or multi-interface controller systems that require integrated memory and wide connectivity.
Designed for board-level deployment with a defined core voltage range and surface-mount 1152‑BBGA packaging, this Intel Stratix V GX device offers a robust platform for scalable designs where on-chip resources and I/O density are priorities.
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