5SGXMA5K2F35C1N

The 5SGXMA5K2F35C1N is a Stratix V GX field-programmable gate array offered in a 1152‑ball FCBGA package. It delivers high logic capacity and on-chip memory with a large I/O complement for demanding digital designs.

Targeted at commercial applications, this device combines 490,000 logic elements, approximately 46 Mbits of embedded RAM, and 432 I/O pins to support complex signal processing, high‑density logic integration, and multi‑interface designs while operating within a 0.87–0.93 V core supply range.

Key Features

• Core Capacity  490,000 logic elements (logic cells) for implementing large-scale custom logic and processing pipelines.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, packet storage, and stateful processing without immediate external memory dependence.
• I/O Density  432 I/O pins to enable broad peripheral and interface connectivity for multi‑lane and multi‑channel applications.
• Power and Supply  Core voltage supply range of 0.87 V to 0.93 V for the device core, allowing predictable power domain planning.
• Package & Mounting  1152‑BBGA (FCBGA) package, supplier package listed as 1152‑FBGA (35×35); surface‑mount mounting type suited for modern PCB assembly.
• Temperature & Grade  Commercial grade operation from 0 °C to 85 °C for standard commercial deployments.
• Compliance  RoHS compliant, meeting common environmental restrictions for lead‑free manufacturing.
• Series-level Transceiver Information  As documented for Stratix V GX devices in the series datasheet, GX transceiver speed grades are specified in the series documentation (series examples include GX channel speed options documented up to 14.1 Gbps).

Typical Applications

• High‑speed serial and networking interfaces  High I/O count and Stratix V GX series transceiver capabilities (as documented in the series datasheet) support multi‑lane serial communications and interface aggregation.
• Signal processing and buffering  Large on‑chip RAM and extensive logic resources enable real‑time data buffering, packet processing, and custom DSP pipelines.
• Complex control and protocol offload  High logic density and plentiful I/O allow implementation of protocol stacks, offload engines, and custom control logic within a single device.

Unique Advantages

• High logic capacity: 490,000 logic elements provide substantial room for complex designs and feature-rich implementations without frequent FPGA family migration.
• Significant embedded memory: Approximately 46 Mbits of RAM reduces reliance on external memory for many buffering and state‑storage tasks, simplifying board design.
• Robust I/O complement: 432 I/O pins facilitate simultaneous connections to multiple peripherals, ADC/DAC front ends, or multi‑lane interfaces.
• Commercial temperature grade: Rated 0 °C to 85 °C for commercial deployments where standard operating conditions are expected.
• Standard surface‑mount package: 1152‑FBGA (35×35) package supports modern PCB assembly processes and high‑density board layouts.
• RoHS compliant: Conforms to common environmental manufacturing requirements for lead‑free production.

Why Choose 5SGXMA5K2F35C1N?

This Stratix V GX device balances high logic capacity, substantial on‑chip memory, and a large I/O count in a single commercial‑grade FCBGA package, making it suitable for complex digital designs that require integrated resources and flexible interfacing. It is a pragmatic choice for teams building high‑density logic, real‑time data processing, or multi‑interface systems who need predictable electrical and thermal operating parameters.

Backed by the Stratix V series documentation, the part provides a well‑documented foundation for transceiver and I/O timing considerations at the series level, enabling informed design tradeoffs and system integration planning.

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