5SGXMA5K2F35C1WN

The 5SGXMA5K2F35C1WN is an Intel Stratix® V GX field programmable gate array (FPGA) supplied in a 1152-BBGA (1152-FBGA, 35×35) surface-mount package. Designed for commercial-temperature applications, it provides a high logic element count and substantial on-chip memory for complex digital designs.

Key deployment scenarios include dense logic implementations and high-channel I/O systems that require a large number of programmable logic resources, abundant embedded RAM, and a compact BGA package for board-level integration.

Key Features

• Core Logic — 490,000 logic elements (logic cells) to implement complex digital functions, state machines, and custom datapaths.
• Embedded Memory — Approximately 46.08 Mbits of on-chip RAM for buffering, packet storage, and large local data structures.
• I/O Capacity — 432 user I/Os to support wide parallel interfaces, multiple bus channels, and dense board-level connectivity.
• Package & Mounting — 1152-BBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor for compact system integration.
• Power — Voltage supply range of 870 mV to 930 mV for core power rails.
• Temperature & Grade — Commercial grade operation with an ambient range of 0 °C to 85 °C.
• Compliance — RoHS-compliant manufacturing status.

Typical Applications

• High-density digital platforms — Implement large custom logic blocks, protocol stacks, and processing pipelines using the device's high logic element count and embedded RAM.
• Multi-channel I/O systems — Support wide parallel interfaces, sensor arrays, or multi-lane data aggregation with 432 available I/Os.
• Embedded system prototyping — Validate complex SoC concepts and hardware accelerators that require substantial on-chip memory and logic resources in a compact package.

Unique Advantages

• High logic density: 490,000 logic elements enable implementation of large-scale digital designs without immediate partitioning across multiple devices.
• Substantial on-chip RAM: Approximately 46.08 Mbits of embedded memory reduces dependence on external memory for many buffer and stateful tasks.
• Extensive I/O headroom: 432 I/Os simplify integration of wide buses and multi-channel peripherals with fewer external interface components.
• Compact BGA integration: 1152-BBGA (35×35) footprint balances high pin count with a board-friendly surface-mount package for dense system layouts.
• Commercial temperature suitability: Rated 0 °C to 85 °C for mainstream industrial and commercial deployments.
• Regulatory compliance: RoHS-compliant construction supports modern environmental requirements.

Why Choose 5SGXMA5K2F35C1WN?

This Stratix V GX FPGA combines large logic capacity, significant embedded memory, and a high I/O count in a single, compact 1152-BBGA package—making it a practical choice for designers building complex digital systems that require dense on-chip resources. Its commercial-grade temperature range and defined core voltage window provide clear system-level parameters for integration into mainstream embedded and communication applications.

Engineers specifying this device benefit from a balance of integration and board-level density, suitable for projects that prioritize on-chip resources and high I/O connectivity while maintaining standard commercial operating conditions.

Request a quote or submit an inquiry for pricing and availability to begin procurement and integration planning for 5SGXMA5K2F35C1WN.