5SGXMA5K2F35C2N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 46080000 490000 1152-BBGA, FCBGA

Quantity 996 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5K2F35C2N – Stratix® V GX FPGA, 490,000 logic elements, ~46 Mbits embedded memory, 432 I/Os

The 5SGXMA5K2F35C2N is a Stratix® V GX field programmable gate array (FPGA) from Intel, provided in a 1152-FBGA (35×35) surface-mount package. It delivers high logic capacity and substantial on-chip memory with a commercial-grade operating temperature range.

With 490,000 logic elements, approximately 46 Mbits of embedded RAM and 432 I/Os, this device is targeted at designs that require dense programmable logic, large embedded memory, and broad I/O integration. As part of the Stratix V GX family, the series supports high-speed transceiver speed grades documented for the family.

Key Features

  • Core Logic  490,000 logic elements for high-density programmable logic implementations.
  • Embedded Memory  Approximately 46 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage.
  • I/O Capacity  432 user I/Os to enable extensive peripheral and board-level connectivity.
  • Transceiver Family Capability  Part of the Stratix V GX family, which is documented to include transceiver speed grades for high-speed serial channels (series-level detail).
  • Power  Core voltage supply range documented at 870 mV to 930 mV to match system power domains.
  • Package & Mounting  1152-FBGA (35×35) package in a surface-mount form factor for compact board-level integration.
  • Operating Conditions  Commercial-grade device with specified operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • High-density digital systems  Large logic capacity and embedded RAM enable complex digital designs that require substantial programmable resources.
  • Network and communications modules  High logic count and series-level transceiver capability make the device suitable for designs requiring high-speed serial connectivity and packet processing.
  • Prototyping and system integration  Abundant I/O and on-chip memory support integration of multiple IP blocks and interface functions on a single device.

Unique Advantages

  • High logic density: 490,000 logic elements provide the capacity to implement large-scale custom logic and multiple concurrent functions on one device.
  • Substantial on-chip memory: Approximately 46 Mbits of embedded RAM reduces external memory dependencies and simplifies board-level designs.
  • Extensive I/O availability: 432 I/Os allow flexible interfacing to peripherals, daughtercards, and high-pin-count systems.
  • Compact package: 1152-FBGA (35×35) packaging delivers a high-pin-count solution in a compact surface-mount form factor for space-constrained boards.
  • Commercial-grade reliability: Specified operating range of 0 °C to 85 °C aligns with standard commercial deployment environments.
  • Standards-conscious supply: RoHS compliance supports regulatory and manufacturing requirements.

Why Choose 5SGXMA5K2F35C2N?

The 5SGXMA5K2F35C2N combines large programmable logic resources, significant embedded memory, and broad I/O integration in a single Stratix V GX family device from Intel. This combination is suited to designers who need to consolidate complex digital functions, buffering, and interfaces into a single FPGA package while operating within commercial temperature ranges.

Selecting this device provides a scalable programmable platform for high-density designs, with documentation and series-level transceiver capability available from the Stratix V GX family. The device supports system-level integration goals by reducing external component count and enabling compact, surface-mounted board designs.

Request a quote or submit a purchase inquiry to evaluate 5SGXMA5K2F35C2N for your next high-density FPGA design.

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