5SGXMA5K2F35C3WN

The 5SGXMA5K2F35C3WN is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers high logic capacity and significant on‑chip RAM in a high‑density FCBGA package for designs that require substantial programmable logic and I/O resources.

This commercial‑grade device provides 490,000 logic elements, approximately 46 Mbits of embedded memory, and 432 user I/O, supporting complex system integration in a surface‑mount 1152‑BBGA (35 × 35) package. It is RoHS‑compliant and rated for operation from 0 °C to 85 °C with a core supply range of 820 mV to 880 mV.

Key Features

• Core Capacity  490,000 logic elements for high-density programmable logic integration.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM to support large buffering and state storage.
• I/O  432 user I/O pins to accommodate wide, parallel interfaces and versatile external connectivity.
• Package & Mounting  1152‑BBGA (FCBGA) supplier device package (1152‑FBGA, 35 × 35) designed for surface‑mount assembly.
• Power  Core voltage supply range of 820 mV to 880 mV for device operation within specified power rails.
• Operating Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS‑compliant manufacturing.

Typical Applications

• High‑density digital processing  Use the extensive logic element count and embedded RAM for complex datapath and control logic implementations.
• I/O‑rich systems  Leverage 432 I/O pins to interface with multiple parallel buses, sensors, or peripheral subsystems.
• Prototyping and design acceleration  Deploy the device in FPGA‑based prototypes that require significant programmable resources and memory.
• Embedded compute and custom logic  Implement custom accelerators and state machines using the large logic fabric and on‑chip RAM.

Unique Advantages

• High logic density: 490,000 logic elements enable implementation of large, complex designs on a single device, reducing board‑level partitioning.
• Substantial embedded memory: Approximately 46 Mbits of on‑chip RAM supports buffering, lookup tables, and state storage without immediate dependence on external memory.
• Extensive I/O capacity: 432 I/O pins simplify integration with multiple external interfaces and parallel signal paths.
• Compact high‑pin package: 1152‑BBGA (35 × 35) delivers a dense pinout in a surface‑mount form factor suitable for space‑constrained boards.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to meet standard commercial application environments.
• Regulatory readiness: RoHS compliance supports environmentally responsible product design and manufacturing.

Why Choose 5SGXMA5K2F35C3WN?

The 5SGXMA5K2F35C3WN positions itself as a high‑capacity Stratix V GX FPGA option for engineers who need a combination of large programmable logic, significant embedded memory, and abundant I/O in a single, surface‑mount package. Its commercial grade, RoHS compliance, and defined operating and supply ranges make it suitable for demanding digital designs where integration density and on‑chip resources matter.

This device is well suited for development teams and OEMs targeting complex FPGA implementations that require scalability, on‑chip memory resources, and high I/O count while remaining within commercial temperature and supply specifications.

Request a quote or submit an RFQ to learn more about availability and procurement options for the 5SGXMA5K2F35C3WN.