5SGXMA5K2F35I2N

The 5SGXMA5K2F35I2N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC optimized for high-density programmable logic and embedded memory. It integrates 490,000 logic elements and approximately 46.08 Mbits of embedded memory to support complex digital designs that require large on-chip resources.

Designed for industrial-temperature operation, this device offers a broad I/O count and industry-standard BGA packaging for surface-mount assembly, making it suitable for demanding applications where high integration and reliable operation between −40 °C and 100 °C are required.

Key Features

• Core Capacity — 490,000 logic elements and 185,000 LABs (logic array blocks) to implement large-scale programmable logic and custom architectures.
• Embedded Memory — Approximately 46.08 Mbits of embedded memory to support buffering, on-chip data storage, and complex state machines.
• I/O — 432 I/O pins to accommodate multiple interfaces, external peripherals, and board-level connectivity.
• Transceiver Family Context — Part of the Stratix V GX family, which is documented with GX transceiver speed-grade options in the Stratix V device literature.
• Power — Core supply operating range from 870 mV to 930 mV to match board-level power architecture requirements.
• Package & Mounting — 1152-BBGA / 1152-FBGA (35×35) FCBGA package for high pin-count, surface-mount applications.
• Temperature Grade — Industrial grade operation from −40 °C to 100 °C for use in temperature-demanding environments.
• Compliance — RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Networking & Communications — Use the high logic density, extensive I/O, and Stratix V GX transceiver family context for interface-intensive networking, switching, and protocol-bridging functions.
• High-Performance Signal Processing — Leverage the large logic and embedded memory resources for data-path acceleration, real-time processing, and custom DSP pipelines.
• Industrial Control — Industrial temperature rating and robust packaging suit factory automation, motor control, and machine-vision controllers that require on-board programmability.

Unique Advantages

• Large On-Chip Resources: 490,000 logic elements and approximately 46.08 Mbits of embedded memory reduce the need for external components and simplify board-level architecture.
• High I/O Count: 432 I/Os enable complex interfacing without multiplexing compromises, supporting multiple parallel buses and high-pin-count peripherals.
• Industrial Temperature Support: Rated from −40 °C to 100 °C for deployment in temperature-challenging environments common to industrial applications.
• Industry-Standard Packaging: 1152-FBGA (35×35) package provides a compact, high-density solution for surface-mount assembly and mature PCB design practices.
• Documented Family Characteristics: As a Stratix V GX-family device, it aligns with the series’ documented electrical and transceiver characteristics for predictable system design.
• Regulatory Compliance: RoHS compliance supports environmental requirements and simplifies regulatory planning.

Why Choose 5SGXMA5K2F35I2N?

The 5SGXMA5K2F35I2N combines substantial logic density, significant embedded memory, and a high I/O count in an industrial-grade Stratix V GX FPGA package. It is positioned for designs that require heavy on-chip processing, broad interfacing capability, and stable operation across extended temperature ranges.

This device is appropriate for engineering teams building programmable, high-performance systems where integration density and documented Stratix V family characteristics provide design confidence and long-term scalability.

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