5SGXMA5K2F35I2WN

The 5SGXMA5K2F35I2WN is an Intel Stratix V GX field programmable gate array supplied in a 1152-BBGA FCBGA package. It delivers a high-density programmable fabric with a large embedded memory array and a substantial I/O complement for demanding industrial applications.

Key on-chip resources include 490,000 logic elements and 46,080,000 bits of embedded RAM, while the device supports industrial temperature operation and a low-voltage core supply—making it suitable for thermally and power-constrained designs that require high integration.

Key Features

• Core Logic — 490,000 logic elements for complex programmable logic and custom hardware acceleration.
• Embedded Memory — 46,080,000 bits of on-chip RAM (approximately 46 Mbits) to support large buffering, lookup tables, and state storage without external memory.
• I/O Density — 432 general-purpose I/Os to enable rich external connectivity and high-pin-count interfaces.
• Package — 1152-BBGA (supplier package: 1152-FBGA, 35×35) providing a compact, high-pin-count surface-mount solution.
• Power Supply — Core voltage range of 870 mV to 930 mV to match low-voltage system architectures.
• Operating Temperature — Industrial-grade temperature range from −40 °C to 100 °C for reliable operation in harsh environments.
• Mounting — Surface-mount package suitable for modern PCB assembly processes.
• RoHS Compliant — Meets RoHS environmental requirements.

Unique Advantages

• High logic density: 490,000 logic elements enable implementation of complex algorithms and system-level integration on a single device.
• Large embedded memory: 46,080,000 bits of on-chip RAM reduce dependence on external memory and simplify board-level design.
• Robust I/O capability: 432 I/Os provide flexibility for interfacing to multiple peripherals, high-speed links, and parallel buses.
• Industrial temperature rating: −40 °C to 100 °C supports deployment in industrial and temperature-challenging environments.
• Compact, high-pin-count package: 1152-BBGA (35×35 FBGA) offers a balance of density and board-space efficiency for high-performance designs.
• Low-voltage core operation: 870–930 mV core supply aligns with modern low-power system power domains.

Why Choose 5SGXMA5K2F35I2WN?

The 5SGXMA5K2F35I2WN combines substantial logic capacity, significant on-chip memory, and a high I/O count in a single industrial-grade FPGA package. These measurable attributes make it well suited for designers who need to consolidate complex functions, reduce external component count, and maintain operation across a wide temperature range.

For projects requiring high integration and predictable electrical characteristics—delivered by Intel's Stratix V GX family—this device offers a pragmatic balance of performance, density, and board-level efficiency, backed by documented device specifications and package information.

Request a quote or submit an inquiry to obtain pricing and availability for the 5SGXMA5K2F35I2WN. Our team can provide lead-time and ordering details to support your design timeline.