5SGXMA5K2F35I3N

The 5SGXMA5K2F35I3N is an Intel Stratix® V GX-series field programmable gate array optimized for designs that require high logic capacity, substantial on-chip memory, and a large number of I/Os in an industrial-grade package. It is supplied in a 1152-ball FCBGA package (1152-FBGA, 35×35) and is designed for surface-mount PCB assembly.

This device provides approximately 490,000 logic elements, roughly 46.08 Mbits of embedded RAM, and 432 general-purpose I/Os. The part targets applications that need scalable programmable logic with robust operating-temperature range and a low-voltage core supply (820 mV to 880 mV).

Key Features

• Core Capacity  Approximately 490,000 logic elements to implement high-density logic and complex designs.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM for buffering, frame storage, and algorithm acceleration without external memory for many use cases.
• I/O Density  432 I/Os to support large, high-pin-count system interfaces and board-level connectivity.
• Package & Mounting  1152-ball BGA, FCBGA package (supplier package: 1152-FBGA, 35×35); surface-mount mounting type for standard PCB assembly flows.
• Power  Core voltage supply specified from 820 mV to 880 mV.
• Temperature & Grade  Industrial temperature grade rated from −40 °C to 100 °C for deployment in demanding environments.
• Standards Compliance  RoHS compliant.
• Series-Level Documentation  Stratix V device documentation covers electrical and switching characteristics, including I/O timing and programmable output delays for GX devices.

Typical Applications

• Industrial Control and Automation  Industrial-grade temperature range and high logic capacity make the device suitable for control systems and automation tasks that require significant programmable logic and memory.
• High‑Density I/O Systems  Large I/O count supports systems that aggregate many sensors, peripherals, or board-to-board interfaces.
• Signal Processing and Algorithm Acceleration  Substantial embedded RAM and logic resources enable implementation of complex DSP, packet processing, or custom acceleration functions.
• Prototype and System Integration  High logic element count and flexible I/O allocation support advanced prototyping, system integration, and FPGA-based platform designs.

Unique Advantages

• High Logic Density: Approximately 490,000 logic elements provide headroom for large designs and multi-function implementations.
• Significant On‑Chip RAM: Around 46.08 Mbits of embedded memory reduces dependence on external memory for many buffering and storage needs.
• Large I/O Count: 432 I/Os simplify routing of multi-channel systems and reduce the need for external expanders.
• Industrial‑Grade Operation: −40 °C to 100 °C rating supports operation across a wide range of industrial environments.
• Compact, High‑Pin Package: 1152-ball FCBGA (35×35) offers a compact footprint with a high pin-count interface for dense board integration.
• Low‑Voltage Core: Core supply range of 820 mV to 880 mV supports contemporary low-voltage FPGA power architectures.

Why Choose 5SGXMA5K2F35I3N?

The 5SGXMA5K2F35I3N combines high logic capacity, large embedded memory, and extensive I/O in an industrial-grade Stratix V GX package. It is well suited to systems that demand programmable performance, significant on-chip storage, and robust environmental tolerance.

For engineering teams and procurement focused on scalable FPGA solutions, this device delivers a balance of integration and density that supports complex signal processing, high‑I/O systems, and industrial control applications, backed by Stratix V family documentation for electrical and switching characteristics.

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