5SGXMA5K2F35I3WN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 46080000 490000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 972 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5K2F35I3WN – Stratix® V GX Field Programmable Gate Array (FPGA) IC
The 5SGXMA5K2F35I3WN is a Stratix® V GX family FPGA offering high-density programmable logic and substantial on-chip memory. It combines a large logic fabric with ample embedded RAM and a high I/O count to support complex digital designs.
Designed for industrial-grade operation, this device provides a defined core supply range and a wide operating temperature window to meet demanding system requirements where robustness and integration are important.
Key Features
- Logic Capacity — 490,000 logic elements and 185,000 LABs to implement large-scale digital functions and complex state machines.
- Embedded Memory — Approximately 46 Mbits of on-chip RAM for buffering, lookup tables, and on-device data storage.
- I/O Resources — 432 user I/O pins to interface with high-pin-count peripherals and system-level buses.
- Power and Core Supply — Core voltage supply specified from 820 mV to 880 mV for predictable power design and supply planning.
- Package and Mounting — 1152-BBGA FCBGA package (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor for compact board integration.
- Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
- Compliance — RoHS-compliant to support environmental and manufacturing requirements.
Unique Advantages
- High integration density: Hundreds of thousands of logic elements and tens of megabits of embedded RAM reduce the need for additional external components and simplify system architecture.
- Large I/O count: 432 I/Os enable rich peripheral connectivity and flexible board-level routing options.
- Industrial-grade operation: The –40 °C to 100 °C rating and defined core supply range support reliable operation across a wide range of environmental conditions.
- Compact surface-mount package: The 1152-BBGA/FBGA package balances high pin count with a compact PCB footprint for space-constrained designs.
- Standards-aligned manufacturing: RoHS compliance supports modern production and regulatory requirements.
Why Choose 5SGXMA5K2F35I3WN?
This Stratix V GX FPGA is positioned for applications that require high logic density, substantial embedded memory, and a large number of I/Os within an industrial temperature envelope. Its measurable specifications—490,000 logic elements, approximately 46 Mbits of RAM, 432 I/Os, and a 1152-BBGA package—make it suitable for designs where integration and predictable electrical and thermal behavior are priorities.
Engineers and procurement teams can rely on the device’s defined electrical and environmental specifications to plan power delivery, thermal management, and PCB layout while leveraging the Stratix V device family datasheet for additional electrical characteristics and operating conditions.
Request a quote or submit a sales inquiry to receive pricing, availability, and ordering information for part 5SGXMA5K2F35I3WN.

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