5SGXMA5K2F35I3G

The 5SGXMA5K2F35I3G is a Stratix® V GX field programmable gate array (FPGA) from Intel, delivered in a 1152‑ball FCBGA package. It provides a high logic capacity and substantial on‑chip memory with industrial temperature grading for designs that require robust operation across a wide thermal range.

With 490,000 logic elements, approximately 46 Mbits of embedded memory, and 432 device I/Os, this device targets high‑density, high‑capacity FPGA implementations where logic resources, I/O count, and extended operating temperature are key selection criteria.

Key Features

• Core Logic Capacity  490,000 logic elements provide substantial programmable fabric for complex digital designs and large‑scale implementation of custom logic.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM to support large buffering, lookup tables, and memory‑intensive logic functions.
• I/O Density  432 device I/Os to interface with high fan‑out systems, multiple peripherals, or extensive board‑level connectivity.
• Package  1152‑BBGA, FCBGA (supplier package: 1152‑FBGA, 35×35) for high‑density board integration and reliable BGA mounting.
• Power Supply  Operates from a core voltage supply in the range of 820 mV to 880 mV, enabling predictable power domain planning for system design.
• Thermal and Environmental Rating  Industrial grade with an operating temperature range of −40°C to 100°C for reliable performance in demanding environments.
• Mounting Type  Surface mount package suitable for modern PCB assembly processes.
• RoHS Compliant  Meets RoHS requirements for restricted substances.

Typical Applications

• High‑density signal processing  Large logic capacity and significant on‑chip RAM enable complex DSP, filtering, and pipeline implementations.
• Networking and packet processing  High I/O count and dense programmable fabric support multi‑lane interfaces and custom packet‑handling logic.
• Industrial control and automation  Industrial temperature rating (−40°C to 100°C) and robust packaging make the device suitable for control, monitoring, and automation systems.
• Acceleration and offload  Substantial logic and memory resources allow hardware acceleration of compute‑intensive tasks within larger systems.

Unique Advantages

• Large programmable fabric: 490,000 logic elements enable consolidation of multiple functions into a single device, reducing board count and system complexity.
• Significant embedded memory: Approximately 46 Mbits of RAM support deep buffering and on‑chip data structures, improving throughput and latency.
• High I/O availability: 432 device I/Os provide flexibility for interfacing with sensors, transceivers, and peripheral devices without external multiplexing.
• Industrial thermal range: Rated from −40°C to 100°C for deployments in temperature‑challenging environments.
• Compact, high‑ball‑count package: 1152‑BBGA (35×35) delivers high pin density while preserving board area for surrounding components.
• Controlled core voltage window: 820–880 mV core supply range supports predictable power budgeting and system integration.

Why Choose 5SGXMA5K2F35I3G?

The 5SGXMA5K2F35I3G positions itself as a high‑capacity Stratix V GX FPGA option for designs that need extensive logic resources, sizable on‑chip memory, and a large number of I/Os in an industrial‑rated device. Its combination of nearly half a million logic elements, approximately 46 Mbits of embedded RAM, and 432 I/Os makes it well suited for demanding applications that require integration of multiple high‑performance functions on a single chip.

Designed for systems where thermal range, dense packaging, and predictable core power are important, this device supports scalable designs that benefit from Intel’s Stratix V GX family characteristics and established device documentation.

Request a quote or submit your configuration and quantity requirements to receive pricing and availability information for the 5SGXMA5K2F35I3G.