5SGXMA5K2F35I2LG

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 46080000 490000 1152-BBGA, FCBGA

Quantity 341 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5K2F35I2LG – Stratix V GX FPGA, 490,000 logic elements, ~46 Mbits RAM, 432 I/O, Industrial

The 5SGXMA5K2F35I2LG is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, providing a high-density programmable logic platform. It combines a large logic fabric with substantial embedded memory and a broad I/O count to address demanding, high-resource designs.

Engineered for industrial-grade operation, this device delivers significant on-chip resources and flexible packaging options for applications that require large logic capacity, sizable embedded RAM, and extensive I/O connectivity.

Key Features

  • Logic Capacity — 490,000 logic elements for complex digital designs and large-scale programmable logic integration.
  • Embedded Memory — Approximately 46 Mbits of on-chip RAM to support buffering, lookup tables, and data storage within the FPGA fabric.
  • I/O Resources — 432 dedicated I/O pins to interface with high-pin-count peripherals, external memories, and multi-channel systems.
  • Power Supply — Core voltage supply range of 820 mV to 880 mV to match system power domains and enable predictable core operation.
  • Package Options — 1152-ball BGA package (1152-FBGA, 35×35 mm) in FCBGA style for compact board-level integration and thermal conduction.
  • Industrial Temperature Grade — Specified operating range from −40 °C to 100 °C for reliable performance in industrial environments.
  • Mounting & Compliance — Surface-mount device with RoHS compliance for lead-free assembly and regulatory alignment.

Typical Applications

  • High-density digital signal processing — Leverage large logic and embedded RAM to implement multi-channel DSP pipelines and real-time data manipulation.
  • Network and communications equipment — Use the device’s extensive I/O count and high logic capacity for packet processing, protocol adaptation, and interface bridging.
  • Hardware acceleration and custom compute — Deploy application-specific accelerators and custom compute blocks that benefit from on-chip memory and large programmable resources.
  • Test, measurement, and instrumentation — Integrate complex measurement logic and data staging with the FPGA’s ample resources and industrial temperature rating.

Unique Advantages

  • High logic density: 490,000 logic elements enable consolidation of multiple functions into a single device, reducing BOM and board complexity.
  • Substantial embedded memory: Approximately 46 Mbits of on-chip RAM support buffering and stateful logic without immediate need for external memory.
  • Extensive I/O capability: 432 I/O pins provide the flexibility to connect numerous high-pin-count peripherals and back-end interfaces.
  • Industrial-grade robustness: Rated for −40 °C to 100 °C operation to meet the environmental demands of industrial applications.
  • Compact FCBGA packaging: 1152-ball FBGA (35×35 mm) package balances high pin count with a compact footprint for dense system designs.
  • Standards-minded compliance: RoHS compliance facilitates lead-free assembly and conformance to environmental regulations.

Why Choose 5SGXMA5K2F35I2LG?

The 5SGXMA5K2F35I2LG positions itself as a high-capacity, industrial-grade Stratix V GX FPGA suitable for designs that demand significant programmable logic, embedded memory, and broad I/O connectivity. Its combination of nearly half a million logic elements, approximately 46 Mbits of on-chip RAM, and 432 I/O pins supports consolidation of complex subsystems into a single device.

This device is appropriate for engineering teams building industrial, communications, and compute-accelerated systems that require scalable logic resources and reliable operation across a wide temperature range. Its FCBGA 1152-ball package and RoHS compliance make it practical for modern surface-mount production environments.

Request a quote or submit an RFQ for 5SGXMA5K2F35I2LG to get pricing and availability tailored to your project needs.

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