5SGXMA5K2F35I2G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 46080000 490000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 756 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5K2F35I2G – Stratix® V GX FPGA, 490,000 logic elements, ~46.08 Mbits RAM, 432 I/O
The 5SGXMA5K2F35I2G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC delivering high-density programmable logic and on-chip memory. The device integrates approximately 490,000 logic elements and approximately 46.08 Mbits of embedded memory to support complex digital designs.
Built for industrial use, this surface-mount FCBGA device provides 432 user I/Os, operates from a core supply range of 870 mV to 930 mV, and is specified for an operating temperature range of -40 °C to 100 °C. It is supplied in a 1152-FBGA (35×35) package and is RoHS compliant.
Key Features
- Core logic Approximately 490,000 logic elements for dense programmable logic integration.
- Embedded memory Approximately 46.08 Mbits of total on-chip RAM to support large buffering, state storage, and algorithm acceleration.
- I/O capacity 432 configurable I/O pins to connect to peripherals, buses, and I/O interfaces.
- Power and supply Core voltage supply range from 870 mV to 930 mV for defined power-domain design.
- Package and mounting 1152-BBGA / 1152-FBGA (35×35) FCBGA package; surface-mount device for standard PCB assembly.
- Industrial qualification Grade: Industrial; specified operating temperature range −40 °C to 100 °C for deployment in industrial environments.
- Regulatory RoHS compliant.
Unique Advantages
- High logic and memory density: Combines ~490k logic elements with ~46.08 Mbits of embedded RAM to support complex, high-capacity designs.
- Broad I/O count: 432 I/Os enable rich external connectivity without immediate need for external I/O expanders.
- Industrial temperature range: Rated from −40 °C to 100 °C to meet extended-environment requirements.
- Compact FCBGA package: 1152-FBGA (35×35) footprint provides a high-pin-count solution in a compact form factor for dense board layouts.
- Controlled core voltage range: Defined 870 mV–930 mV supply simplifies power budgeting and domain planning.
- RoHS compliant: Meets hazardous-substance requirements for regulated markets.
Why Choose 5SGXMA5K2F35I2G?
The 5SGXMA5K2F35I2G positions itself as a high-density Stratix V GX FPGA for industrial applications that require substantial programmable logic and embedded memory. Its combination of approximately 490,000 logic elements, about 46.08 Mbits of on-chip RAM, and 432 I/Os provides designers with the resources needed for complex digital signal processing, large state machines, and extensive interfacing without immediately adding external components.
With an industrial temperature rating, a defined core supply range, and a high-pin-count FCBGA package, this device supports robust system designs where integration density and environmental endurance are critical. It is suitable for engineers and procurement teams seeking a verified, RoHS-compliant Stratix V GX FPGA in a 1152-FBGA package.
Request a quote or submit an inquiry to purchase 5SGXMA5K2F35I2G and evaluate its fit for your high-density FPGA design requirements.

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