5SGXMA5K2F35C2WN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 46080000 490000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 365 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5K2F35C2WN – Stratix® V GX FPGA, 490,000 logic elements, 432 I/O, 1152-BBGA
The 5SGXMA5K2F35C2WN is a commercial-grade Stratix® V GX field programmable gate array (FPGA) offering substantial on-chip logic and embedded memory for complex digital designs. As a member of the Stratix V GX family, it is intended for applications that require large logic capacity, significant embedded RAM, and high I/O density.
Key value drivers include a high count of logic elements, approximately 46 Mbits of embedded memory, and a 1152-ball FCBGA package that supports dense board-level integration in surface-mount assemblies.
Key Features
- Core logic capacity Approximately 490,000 logic elements suitable for large, multi-function FPGA designs and complex custom logic implementations.
- Embedded memory Approximately 46 Mbits of on-chip RAM to support buffering, large lookup tables, and memory-intensive algorithms without external RAM in many use cases.
- I/O density 432 user I/O pins to accommodate wide data buses, numerous peripherals, or multi-channel interfaces.
- Package and mounting 1152-BBGA (supplier package: 1152-FBGA, 35×35 mm) in an FCBGA form factor; surface-mount mounting type for compact, high-density PCB designs.
- Power Core voltage supply range of 870 mV to 930 mV, supporting low-voltage core operation as part of power-sensitive designs.
- Commercial operating range Rated for 0 °C to 85 °C operation and supplied as a commercial-grade device.
- RoHS compliant Meets RoHS environmental requirements for lead-free assembly.
Typical Applications
- Data processing and acceleration Large logic capacity and ample embedded memory enable hardware acceleration and complex data-path implementations.
- High-density I/O systems 432 I/O pins support multi-channel interfaces, wide bus implementations, and aggregation of peripheral connections.
- Prototyping and system integration High logic and memory resources make the device well suited to prototype large SoC-like functions and integrate multiple subsystems on a single FPGA.
- Signal processing and DSP Substantial embedded RAM and logic resources support buffer-intensive signal processing, filtering, and custom DSP pipelines.
Unique Advantages
- High logic density: Approximately 490,000 logic elements reduce the need for multiple FPGAs in large designs, simplifying board layout and BOM.
- Significant embedded memory: Approximately 46 Mbits of on-chip RAM provides space for large buffers, lookup tables, and on-chip data storage to minimize external memory requirements.
- Extensive I/O capability: 432 I/O pins provide flexibility to connect numerous peripherals, high-bandwidth interfaces, or multiple parallel channels.
- Compact, high-pin-count package: 1152-ball FCBGA (35×35) enables dense PCB routing while maintaining high pin count for system-level integration.
- Low-voltage core operation: 870 mV–930 mV supply range supports designs optimized for reduced core power consumption.
- Commercial-grade qualification and RoHS compliance: Rated for 0 °C to 85 °C and RoHS compliant for broad commercial deployments and standard manufacturing processes.
Why Choose 5SGXMA5K2F35C2WN?
The 5SGXMA5K2F35C2WN combines a large logic resource pool, substantial embedded memory, and a high I/O count in a compact 1152-ball FCBGA package—making it a practical choice for designers who need to consolidate complex digital functions onto a single FPGA. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of commercial applications where integration density and on-chip resources are priorities.
Engineers and system designers who require scalable logic capacity, significant on-chip RAM, and flexible I/O will find this Stratix V GX device applicable for demanding prototyping, data processing, and multi-channel systems where board-level integration and reduced external components are important.
Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the 5SGXMA5K2F35C2WN.

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