5SGXMA5K2F35C2WN

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 46080000 490000 1152-BBGA, FCBGA

Quantity 365 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5K2F35C2WN – Stratix® V GX FPGA, 490,000 logic elements, 432 I/O, 1152-BBGA

The 5SGXMA5K2F35C2WN is a commercial-grade Stratix® V GX field programmable gate array (FPGA) offering substantial on-chip logic and embedded memory for complex digital designs. As a member of the Stratix V GX family, it is intended for applications that require large logic capacity, significant embedded RAM, and high I/O density.

Key value drivers include a high count of logic elements, approximately 46 Mbits of embedded memory, and a 1152-ball FCBGA package that supports dense board-level integration in surface-mount assemblies.

Key Features

  • Core logic capacity  Approximately 490,000 logic elements suitable for large, multi-function FPGA designs and complex custom logic implementations.
  • Embedded memory  Approximately 46 Mbits of on-chip RAM to support buffering, large lookup tables, and memory-intensive algorithms without external RAM in many use cases.
  • I/O density  432 user I/O pins to accommodate wide data buses, numerous peripherals, or multi-channel interfaces.
  • Package and mounting  1152-BBGA (supplier package: 1152-FBGA, 35×35 mm) in an FCBGA form factor; surface-mount mounting type for compact, high-density PCB designs.
  • Power  Core voltage supply range of 870 mV to 930 mV, supporting low-voltage core operation as part of power-sensitive designs.
  • Commercial operating range  Rated for 0 °C to 85 °C operation and supplied as a commercial-grade device.
  • RoHS compliant  Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

  • Data processing and acceleration  Large logic capacity and ample embedded memory enable hardware acceleration and complex data-path implementations.
  • High-density I/O systems  432 I/O pins support multi-channel interfaces, wide bus implementations, and aggregation of peripheral connections.
  • Prototyping and system integration  High logic and memory resources make the device well suited to prototype large SoC-like functions and integrate multiple subsystems on a single FPGA.
  • Signal processing and DSP  Substantial embedded RAM and logic resources support buffer-intensive signal processing, filtering, and custom DSP pipelines.

Unique Advantages

  • High logic density: Approximately 490,000 logic elements reduce the need for multiple FPGAs in large designs, simplifying board layout and BOM.
  • Significant embedded memory: Approximately 46 Mbits of on-chip RAM provides space for large buffers, lookup tables, and on-chip data storage to minimize external memory requirements.
  • Extensive I/O capability: 432 I/O pins provide flexibility to connect numerous peripherals, high-bandwidth interfaces, or multiple parallel channels.
  • Compact, high-pin-count package: 1152-ball FCBGA (35×35) enables dense PCB routing while maintaining high pin count for system-level integration.
  • Low-voltage core operation: 870 mV–930 mV supply range supports designs optimized for reduced core power consumption.
  • Commercial-grade qualification and RoHS compliance: Rated for 0 °C to 85 °C and RoHS compliant for broad commercial deployments and standard manufacturing processes.

Why Choose 5SGXMA5K2F35C2WN?

The 5SGXMA5K2F35C2WN combines a large logic resource pool, substantial embedded memory, and a high I/O count in a compact 1152-ball FCBGA package—making it a practical choice for designers who need to consolidate complex digital functions onto a single FPGA. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of commercial applications where integration density and on-chip resources are priorities.

Engineers and system designers who require scalable logic capacity, significant on-chip RAM, and flexible I/O will find this Stratix V GX device applicable for demanding prototyping, data processing, and multi-channel systems where board-level integration and reduced external components are important.

Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the 5SGXMA5K2F35C2WN.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up