5SGXMA5K2F35I3LG

The 5SGXMA5K2F35I3LG is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel, offered in an industrial temperature grade. It provides high logic density, substantial on‑chip RAM, and a large I/O count in a 1152‑ball BGA package suitable for surface‑mount assembly.

Designed for applications that require many programmable logic resources, significant embedded memory, and broad I/O connectivity, this device delivers the core building blocks for complex digital designs while operating across a wide temperature and supply range.

Key Features

• Core & logic — 490,000 logic elements for implementing large-scale programmable logic and custom digital functions.
• Embedded memory — approximately 46.08 Mbits of on-chip RAM to support buffers, FIFOs, and memory‑intensive algorithms without external memory in many use cases.
• I/O density — 432 I/O pins to accommodate wide parallel interfaces, multiple peripherals, and complex board-level connectivity.
• Package & mounting — 1152‑BBGA, FCBGA supplier device package (listed as 1152‑FBGA (35x35)); surface mount device suited for automated PCB assembly.
• Power supply — core voltage supply range from 820 mV to 880 mV to match system power architectures and regulator designs.
• Industrial temperature grade — rated operating temperature from −40 °C to 100 °C for deployment in demanding environments.
• Regulatory status — RoHS compliant.

Typical Applications

• High-density digital systems — Implement large programmable logic designs that benefit from 490,000 logic elements and extensive on-chip RAM.
• Memory-intensive processing — Use the approximately 46.08 Mbits of embedded memory for buffering, packet processing, and dataflow acceleration without immediate dependence on external memory.
• I/O-rich interfaces — Drive parallel and multi‑lane interfaces, sensor arrays, or multiple peripheral buses with the device’s 432 I/Os.

Unique Advantages

• Substantial logic capacity: 490,000 logic elements provide the scale needed for complex FPGA designs and system integration.
• Large on-chip memory: Approximately 46.08 Mbits of embedded RAM reduces external memory requirements for many designs, simplifying board layout and BOM.
• High I/O count: 432 I/Os enable broad connectivity and the ability to interface with numerous peripherals or wide data buses directly on-chip.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in temperature‑challenging environments.
• Compact BGA package: The 1152‑ball FCBGA package offers a dense footprint for high-pin-count implementations in space-constrained designs.
• RoHS compliant: Meets common environmental requirements for modern electronic products.

Why Choose 5SGXMA5K2F35I3LG?

This Stratix V GX device balances high logic density, significant embedded memory, and extensive I/O in a single industrial‑rated FPGA package. It is suited to engineers and system designers who need to consolidate complex digital functions, support memory-heavy processing, and maintain broad board-level connectivity while operating across a wide temperature range.

As part of the Stratix V family, the device is documented within the series’ electrical and switching specifications, enabling design teams to plan power, I/O timing, and thermal considerations from established device documentation.

Request a quote or submit an inquiry to receive pricing, availability, and assistance with integrating the 5SGXMA5K2F35I3LG into your next design.