5SGXMA5K2F35I3LN

The 5SGXMA5K2F35I3LN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC optimized for high-density, programmable digital designs. It integrates up to 490,000 logic elements and approximately 46.08 Mbits of embedded memory to enable complex logic, buffering, and data-path implementations.

Designed for industrial-grade use, the device supports a wide operating temperature range and high I/O count while using a low-voltage core supply. Its 1152-ball FCBGA package and surface-mount mounting make it suitable for compact, high-pin-count board designs.

Key Features

• Core Logic  Up to 490,000 logic elements for implementing large-scale digital logic and custom datapaths.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM to support buffering, FIFOs, and memory-hungry algorithms.
• I/O Density  432 general-purpose I/O pins to support extensive interfacing and parallel connectivity.
• Power  Core voltage supply range of 820 mV to 880 mV for low-voltage operation.
• Package & Mounting  1152-BBGA (FCBGA) supplier package; supplier device package 1152-FBGA (35×35). Surface-mount device suitable for automated assembly.
• Industrial Temperature Range  Rated for operation from −40°C to 100°C and specified as Industrial grade.

Typical Applications

• High-density logic systems  Designs requiring large-scale programmable logic capacity—leveraging ~490,000 logic elements and extensive on-chip RAM.
• Wide I/O interfacing  Systems that need many external connections can benefit from the device’s 432 I/Os for parallel and multi-protocol interfaces.
• Industrial embedded processing  Implementations that demand industrial temperature operation and robust packaging for deployed equipment.

Unique Advantages

• High logic integration: Support for 490,000 logic elements reduces the need for multiple devices in complex designs.
• Substantial on-chip memory: Approximately 46.08 Mbits of embedded RAM enables local buffering and high-throughput data handling without external memory dependence.
• Extensive I/O count: 432 I/Os provide flexibility for parallel buses, external peripherals, and wide connectivity options.
• Industrial-grade thermal headroom: Rated from −40°C to 100°C for deployment in temperature-challenging environments.
• Compact, high-pin-count package: 1152-ball FCBGA (35×35) supports dense pinout requirements while remaining surface-mount compatible.
• Low-voltage core operation: 820 mV–880 mV supply range supports designs targeting low-voltage power domains.

Why Choose 5SGXMA5K2F35I3LN?

The 5SGXMA5K2F35I3LN balances large programmable logic capacity, substantial embedded memory, and high I/O count within an industrial-grade FPGA footprint. Its combination of ~490,000 logic elements and approximately 46.08 Mbits of on-chip RAM makes it well suited for dense digital designs that require on-package resources and broad connectivity.

Engineers and procurement teams seeking a single-device solution for complex logic integration, high-throughput buffering, and robust thermal performance will find this Stratix® V GX FPGA a practical option for scalable, industrial deployments.

Request a quote or submit a pricing inquiry to begin evaluating the 5SGXMA5K2F35I3LN for your designs.